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Lazarov, V K, Kohn, A, Uhrmann, T, Dimopoulos, T, Brückl, H, Achard, H, Baraduc, C, Vizzini, S, Oughaddou, H, Aufray, B, d'Avitaya, F A (2008) A TEM structural study of thermal stability of magnetic tunnel junctions integrated with CMOS devices. Journal of Physics: Conference Series, 126. 12002pp. doi:10.1088/1742-6596/126/1/012002

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Reference TypeJournal (article/letter/editorial)
TitleA TEM structural study of thermal stability of magnetic tunnel junctions integrated with CMOS devices
JournalJournal of Physics: Conference Series
AuthorsLazarov, V KAuthor
Kohn, AAuthor
Uhrmann, TAuthor
Dimopoulos, TAuthor
Brückl, HAuthor
Achard, HAuthor
Baraduc, CAuthor
Vizzini, SAuthor
Oughaddou, HAuthor
Aufray, BAuthor
d'Avitaya, F AAuthor
Year2008 (August 1)Volume126
PublisherIOP Publishing
DOIdoi:10.1088/1742-6596/126/1/012002Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID5222022Long-form Identifiermindat:1:5:5222022:7
GUID0
Full ReferenceLazarov, V K, Kohn, A, Uhrmann, T, Dimopoulos, T, Brückl, H, Achard, H, Baraduc, C, Vizzini, S, Oughaddou, H, Aufray, B, d'Avitaya, F A (2008) A TEM structural study of thermal stability of magnetic tunnel junctions integrated with CMOS devices. Journal of Physics: Conference Series, 126. 12002pp. doi:10.1088/1742-6596/126/1/012002
Plain TextLazarov, V K, Kohn, A, Uhrmann, T, Dimopoulos, T, Brückl, H, Achard, H, Baraduc, C, Vizzini, S, Oughaddou, H, Aufray, B, d'Avitaya, F A (2008) A TEM structural study of thermal stability of magnetic tunnel junctions integrated with CMOS devices. Journal of Physics: Conference Series, 126. 12002pp. doi:10.1088/1742-6596/126/1/012002
In(2008) Journal of Physics: Conference Series Vol. 126. IOP Publishing

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