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Liu, Wenhong, Guo, Siying, Zhang, Siyu (2019) Temperature field modeling of the plate during hot rolling based on inverse heat conduction problem. Journal of Physics: Conference Series, 1300. 12017pp. doi:10.1088/1742-6596/1300/1/012017

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Reference TypeJournal (article/letter/editorial)
TitleTemperature field modeling of the plate during hot rolling based on inverse heat conduction problem
JournalJournal of Physics: Conference Series
AuthorsLiu, WenhongAuthor
Guo, SiyingAuthor
Zhang, SiyuAuthor
Year2019 (August)Volume1300
PublisherIOP Publishing
DOIdoi:10.1088/1742-6596/1300/1/012017Search in ResearchGate
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Mindat Ref. ID5308443Long-form Identifiermindat:1:5:5308443:7
GUID0
Full ReferenceLiu, Wenhong, Guo, Siying, Zhang, Siyu (2019) Temperature field modeling of the plate during hot rolling based on inverse heat conduction problem. Journal of Physics: Conference Series, 1300. 12017pp. doi:10.1088/1742-6596/1300/1/012017
Plain TextLiu, Wenhong, Guo, Siying, Zhang, Siyu (2019) Temperature field modeling of the plate during hot rolling based on inverse heat conduction problem. Journal of Physics: Conference Series, 1300. 12017pp. doi:10.1088/1742-6596/1300/1/012017
In(2019) Journal of Physics: Conference Series Vol. 1300. IOP Publishing

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