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Riedo, A., Grimaudo, V., Moreno-García, P., Neuland, M. B., Tulej, M., Wurz, P., Broekmann, P. (2015) High depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures. Journal of Analytical Atomic Spectrometry, 30 (12). 2371-2374 doi:10.1039/c5ja00295h

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Reference TypeJournal (article/letter/editorial)
TitleHigh depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures
JournalJournal of Analytical Atomic Spectrometry
AuthorsRiedo, A.Author
Grimaudo, V.Author
Moreno-García, P.Author
Neuland, M. B.Author
Tulej, M.Author
Wurz, P.Author
Broekmann, P.Author
Year2015Volume30
Issue12
PublisherRoyal Society of Chemistry (RSC)
DOIdoi:10.1039/c5ja00295hSearch in ResearchGate
Generate Citation Formats
Mindat Ref. ID5342891Long-form Identifiermindat:1:5:5342891:4
GUID0
Full ReferenceRiedo, A., Grimaudo, V., Moreno-García, P., Neuland, M. B., Tulej, M., Wurz, P., Broekmann, P. (2015) High depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures. Journal of Analytical Atomic Spectrometry, 30 (12). 2371-2374 doi:10.1039/c5ja00295h
Plain TextRiedo, A., Grimaudo, V., Moreno-García, P., Neuland, M. B., Tulej, M., Wurz, P., Broekmann, P. (2015) High depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures. Journal of Analytical Atomic Spectrometry, 30 (12). 2371-2374 doi:10.1039/c5ja00295h
In(2015) Journal of Analytical Atomic Spectrometry Vol. 30 (12) Royal Society of Chemistry (RSC)

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Cedeño López, A., Grimaudo, V., Moreno-García, P., Riedo, A., Tulej, M., Wiesendanger, R., Wurz, P., Broekmann, P. (2018) Towards femtosecond laser ablation ionization mass spectrometric approaches for chemical depth-profiling analysis of lead-free Sn solder bumps with minimized side-wall contributions. Journal of Analytical Atomic Spectrometry, 33 (2). 283-293 doi:10.1039/c7ja00295e
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