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Dai, Houfu, Li, Shaobo, Chen, Genyu (2018) Comparison of subsurface damages on mono-crystalline silicon between traditional nanoscale machining and laser-assisted nanoscale machining via molecular dynamics simulation. Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 414. 61-67 doi:10.1016/j.nimb.2017.10.017

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Reference TypeJournal (article/letter/editorial)
TitleComparison of subsurface damages on mono-crystalline silicon between traditional nanoscale machining and laser-assisted nanoscale machining via molecular dynamics simulation
JournalNuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms
AuthorsDai, HoufuAuthor
Li, ShaoboAuthor
Chen, GenyuAuthor
Year2018 (January)Volume414
PublisherElsevier BV
DOIdoi:10.1016/j.nimb.2017.10.017Search in ResearchGate
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Mindat Ref. ID5655435Long-form Identifiermindat:1:5:5655435:3
GUID0
Full ReferenceDai, Houfu, Li, Shaobo, Chen, Genyu (2018) Comparison of subsurface damages on mono-crystalline silicon between traditional nanoscale machining and laser-assisted nanoscale machining via molecular dynamics simulation. Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 414. 61-67 doi:10.1016/j.nimb.2017.10.017
Plain TextDai, Houfu, Li, Shaobo, Chen, Genyu (2018) Comparison of subsurface damages on mono-crystalline silicon between traditional nanoscale machining and laser-assisted nanoscale machining via molecular dynamics simulation. Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 414. 61-67 doi:10.1016/j.nimb.2017.10.017
In(2018) Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms Vol. 414. Elsevier BV

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