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Li, Qing-Hua, Chen, Shen-Shen, Zeng, Ji-Hui (2013) A meshless model for transient heat conduction analyses of 3D axisymmetric functionally graded solids. Chinese Physics B, 22. 120204pp. doi:10.1088/1674-1056/22/12/120204

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Reference TypeJournal (article/letter/editorial)
TitleA meshless model for transient heat conduction analyses of 3D axisymmetric functionally graded solids
JournalChinese Physics B
AuthorsLi, Qing-HuaAuthor
Chen, Shen-ShenAuthor
Zeng, Ji-HuiAuthor
Year2013 (December)Volume22
PublisherIOP Publishing
DOIdoi:10.1088/1674-1056/22/12/120204Search in ResearchGate
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Mindat Ref. ID6003259Long-form Identifiermindat:1:5:6003259:3
GUID0
Full ReferenceLi, Qing-Hua, Chen, Shen-Shen, Zeng, Ji-Hui (2013) A meshless model for transient heat conduction analyses of 3D axisymmetric functionally graded solids. Chinese Physics B, 22. 120204pp. doi:10.1088/1674-1056/22/12/120204
Plain TextLi, Qing-Hua, Chen, Shen-Shen, Zeng, Ji-Hui (2013) A meshless model for transient heat conduction analyses of 3D axisymmetric functionally graded solids. Chinese Physics B, 22. 120204pp. doi:10.1088/1674-1056/22/12/120204
In(n.d.) Chinese Physics B Vol. 22. IOP Publishing

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