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Mu, Jun-Wei, Sun, Shi-Cheng, Jiang, Zhong-Hao, Lian, Jian-She, Jiang, Qing (2013) Dislocation-mediated creep process in nanocrystalline Cu. Chinese Physics B, 22. 37303pp. doi:10.1088/1674-1056/22/3/037303

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Reference TypeJournal (article/letter/editorial)
TitleDislocation-mediated creep process in nanocrystalline Cu
JournalChinese Physics B
AuthorsMu, Jun-WeiAuthor
Sun, Shi-ChengAuthor
Jiang, Zhong-HaoAuthor
Lian, Jian-SheAuthor
Jiang, QingAuthor
Year2013 (March)Volume22
PublisherIOP Publishing
DOIdoi:10.1088/1674-1056/22/3/037303Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID6003525Long-form Identifiermindat:1:5:6003525:3
GUID0
Full ReferenceMu, Jun-Wei, Sun, Shi-Cheng, Jiang, Zhong-Hao, Lian, Jian-She, Jiang, Qing (2013) Dislocation-mediated creep process in nanocrystalline Cu. Chinese Physics B, 22. 37303pp. doi:10.1088/1674-1056/22/3/037303
Plain TextMu, Jun-Wei, Sun, Shi-Cheng, Jiang, Zhong-Hao, Lian, Jian-She, Jiang, Qing (2013) Dislocation-mediated creep process in nanocrystalline Cu. Chinese Physics B, 22. 37303pp. doi:10.1088/1674-1056/22/3/037303
In(n.d.) Chinese Physics B Vol. 22. IOP Publishing

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