Ren, Huai-Hui, Wang, Xi-Shu (2014) Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads. Chinese Physics B, 23. 44601pp. doi:10.1088/1674-1056/23/4/044601
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads | ||
Journal | Chinese Physics B | ||
Authors | Ren, Huai-Hui | Author | |
Wang, Xi-Shu | Author | ||
Year | 2014 (April) | Volume | 23 |
Publisher | IOP Publishing | ||
DOI | doi:10.1088/1674-1056/23/4/044601Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 6004847 | Long-form Identifier | mindat:1:5:6004847:9 |
GUID | 0 | ||
Full Reference | Ren, Huai-Hui, Wang, Xi-Shu (2014) Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads. Chinese Physics B, 23. 44601pp. doi:10.1088/1674-1056/23/4/044601 | ||
Plain Text | Ren, Huai-Hui, Wang, Xi-Shu (2014) Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads. Chinese Physics B, 23. 44601pp. doi:10.1088/1674-1056/23/4/044601 | ||
In | (n.d.) Chinese Physics B Vol. 23. IOP Publishing |
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