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Dong, Gang, Shi, Tao, Zhao, Ying-Bo, Yang, Yin-Tang (2015) An analytical model of thermal mechanical stress induced by through silicon via. Chinese Physics B, 24. 56601pp. doi:10.1088/1674-1056/24/5/056601

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Reference TypeJournal (article/letter/editorial)
TitleAn analytical model of thermal mechanical stress induced by through silicon via
JournalChinese Physics B
AuthorsDong, GangAuthor
Shi, TaoAuthor
Zhao, Ying-BoAuthor
Yang, Yin-TangAuthor
Year2015 (May)Volume24
PublisherIOP Publishing
DOIdoi:10.1088/1674-1056/24/5/056601Search in ResearchGate
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Mindat Ref. ID6006174Long-form Identifiermindat:1:5:6006174:4
GUID0
Full ReferenceDong, Gang, Shi, Tao, Zhao, Ying-Bo, Yang, Yin-Tang (2015) An analytical model of thermal mechanical stress induced by through silicon via. Chinese Physics B, 24. 56601pp. doi:10.1088/1674-1056/24/5/056601
Plain TextDong, Gang, Shi, Tao, Zhao, Ying-Bo, Yang, Yin-Tang (2015) An analytical model of thermal mechanical stress induced by through silicon via. Chinese Physics B, 24. 56601pp. doi:10.1088/1674-1056/24/5/056601
In(n.d.) Chinese Physics B Vol. 24. IOP Publishing

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