Tsai, Dah-Shyang, Tseng, Chia-Liang (1994) Leaching silicon-based wet gels to approach GRIN. Journal of Non-Crystalline Solids, 169 (1) 160-168 doi:10.1016/0022-3093(94)90236-4
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Leaching silicon-based wet gels to approach GRIN | ||
Journal | Journal of Non-Crystalline Solids | ||
Authors | Tsai, Dah-Shyang | Author | |
Tseng, Chia-Liang | Author | ||
Year | 1994 (March) | Volume | 169 |
Issue | 1 | ||
Publisher | Elsevier BV | ||
DOI | doi:10.1016/0022-3093(94)90236-4Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 633725 | Long-form Identifier | mindat:1:5:633725:8 |
GUID | 0 | ||
Full Reference | Tsai, Dah-Shyang, Tseng, Chia-Liang (1994) Leaching silicon-based wet gels to approach GRIN. Journal of Non-Crystalline Solids, 169 (1) 160-168 doi:10.1016/0022-3093(94)90236-4 | ||
Plain Text | Tsai, Dah-Shyang, Tseng, Chia-Liang (1994) Leaching silicon-based wet gels to approach GRIN. Journal of Non-Crystalline Solids, 169 (1) 160-168 doi:10.1016/0022-3093(94)90236-4 | ||
In | (1994, March) Journal of Non-Crystalline Solids Vol. 169 (1) Elsevier BV |
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