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Kobayashi, Yoshio, Shirochi, Tsukasa, Maeda, Takafumi, Yasuda, Yusuke, Morita, Toshiaki (2013) Microstructure of metallic copper nanoparticles/metallic disc interface in metal-metal bonding using them. Surface and Interface Analysis, 45 (9). 1424-1428 doi:10.1002/sia.5299

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Reference TypeJournal (article/letter/editorial)
TitleMicrostructure of metallic copper nanoparticles/metallic disc interface in metal-metal bonding using them
JournalSurface and Interface Analysis
AuthorsKobayashi, YoshioAuthor
Shirochi, TsukasaAuthor
Maeda, TakafumiAuthor
Yasuda, YusukeAuthor
Morita, ToshiakiAuthor
Year2013 (September)Volume45
Issue9
PublisherWiley
DOIdoi:10.1002/sia.5299Search in ResearchGate
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Mindat Ref. ID6514712Long-form Identifiermindat:1:5:6514712:8
GUID0
Full ReferenceKobayashi, Yoshio, Shirochi, Tsukasa, Maeda, Takafumi, Yasuda, Yusuke, Morita, Toshiaki (2013) Microstructure of metallic copper nanoparticles/metallic disc interface in metal-metal bonding using them. Surface and Interface Analysis, 45 (9). 1424-1428 doi:10.1002/sia.5299
Plain TextKobayashi, Yoshio, Shirochi, Tsukasa, Maeda, Takafumi, Yasuda, Yusuke, Morita, Toshiaki (2013) Microstructure of metallic copper nanoparticles/metallic disc interface in metal-metal bonding using them. Surface and Interface Analysis, 45 (9). 1424-1428 doi:10.1002/sia.5299
In(2013, September) Surface and Interface Analysis Vol. 45 (9) Wiley

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Maeda, Takafumi, Matsubara, Norihisa, Kobayashi, Yoshio, Yasuda, Yusuke, Morita, Toshiaki (2017) Synthesis of nanoparticles composed of silver and copper for metal–metal bonding. Materials Science and Technology, 33. 1618-1625 doi:10.1080/02670836.2017.1303123
Maeda, Takafumi, Kobayashi, Yoshio, Yasuda, Yusuke, Morita, Toshiaki (2012) Metal-Metal Bonding Process Using Ag2O/CuO Mixed Particles. Advanced Materials Research, 622. 945-949 doi:10.4028/www.scientific.net/amr.622-623.945
Kobayashi, Y., Shirochi, T., Yasuda, Y., Morita, T. (2011) Preparation of metallic copper nanoparticles in aqueous solution and their bonding properties. Solid State Sciences, 13 (3) 553-558 doi:10.1016/j.solidstatesciences.2010.12.025
Kobayashi, Y., Shirochi, T., Yasuda, Y., Morita, T. (2013) Synthesis of silver/copper nanoparticles and their metalmetal bonding property. Journal of Mining and Metallurgy, Section B: Metallurgy, 49 (1). 65-70 doi:10.2298/jmmb120927025k
Morita, Toshiaki, Ide, Eiichi, Yasuda, Yusuke, Hirose, Akio, Kobayashi, Kojiro (2008) Study of Bonding Technology Using Silver Nanoparticles. Japanese Journal of Applied Physics, 47 (8) 6615-6622 doi:10.1143/jjap.47.6615
Morita, Toshiaki, Yasuda, Yusuke (2015) New Bonding Technique Using Copper Oxide Materials. MATERIALS TRANSACTIONS, 56 (6). 878-882 doi:10.2320/matertrans.m2014399
Chen, Jie, Wang, Kehong, Zhu, Heguo (2013) Microstructure characteristics and shear properties of welding bonding of W/Al dissimilar metals with copper transitional layer. Surface and Interface Analysis, 45 (5). 901-905 doi:10.1002/sia.5179
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