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Li, Weiguo, Yang, Fan, Fang, Daining (2009) Thermal shock modeling of Ultra-High Temperature Ceramics under active cooling. Computers & Mathematics with Applications, 58. 2373-2378 doi:10.1016/j.camwa.2009.03.080

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Reference TypeJournal (article/letter/editorial)
TitleThermal shock modeling of Ultra-High Temperature Ceramics under active cooling
JournalComputers & Mathematics with Applications
AuthorsLi, WeiguoAuthor
Yang, FanAuthor
Fang, DainingAuthor
Year2009 (December)Volume58
PublisherElsevier BV
DOIdoi:10.1016/j.camwa.2009.03.080Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID6573217Long-form Identifiermindat:1:5:6573217:5
GUID0
Full ReferenceLi, Weiguo, Yang, Fan, Fang, Daining (2009) Thermal shock modeling of Ultra-High Temperature Ceramics under active cooling. Computers & Mathematics with Applications, 58. 2373-2378 doi:10.1016/j.camwa.2009.03.080
Plain TextLi, Weiguo, Yang, Fan, Fang, Daining (2009) Thermal shock modeling of Ultra-High Temperature Ceramics under active cooling. Computers & Mathematics with Applications, 58. 2373-2378 doi:10.1016/j.camwa.2009.03.080
In(n.d.) Computers & Mathematics with Applications Vol. 58. Elsevier BV

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LI, WEIGUO, FANG, DAINING (2008) EFFECTS OF THERMAL ENVIRONMENTS ON THE THERMAL SHOCK RESISTANCE OF ULTRA-HIGH TEMPERATURE CERAMICS. Modern Physics Letters B, 22. 1375-1380 doi:10.1142/s021798490801608x
Li, Weiguo, Yang, Fan, Yao, Xuefeng, Fang, Daining (2012) A Temperature-Damage-Dependent Fracture Strength Model for Ultra-High Temperature Ceramics. Advanced Science Letters, 5 (2). 535-537 doi:10.1166/asl.2012.1989
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Li, Weiguo, Wang, Ruzhuan, Li, Dingyu, Shen, Xueliang, Kou, Haibo, Fang, Daining (2015) Effect of the cooling medium temperature on the thermal shock resistance of ceramic materials. Materials Letters, 138. 216-218 doi:10.1016/j.matlet.2014.09.137
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Zhang, Lu, Tong, Zongwei, He, Rujie, Xie, Chen, Bai, Xuejian, Yang, Yazheng, Fang, Daining (2019) Key issues of MoSi2-UHTC ceramics for ultra high temperature heating element applications: Mechanical, electrical, oxidation and thermal shock behaviors. Journal of Alloys and Compounds, 780. 156-163 doi:10.1016/j.jallcom.2018.11.384
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