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Basaran, Cemal, Chandaroy, Rumpa (2000) Using finite element analysis for simulation of reliability tests on solder joints in microelectronic packaging. Computers & Structures, 74. 215-231 doi:10.1016/s0045-7949(99)00028-0

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Reference TypeJournal (article/letter/editorial)
TitleUsing finite element analysis for simulation of reliability tests on solder joints in microelectronic packaging
JournalComputers & Structures
AuthorsBasaran, CemalAuthor
Chandaroy, RumpaAuthor
Year2000 (January)Volume74
PublisherElsevier BV
DOIdoi:10.1016/s0045-7949(99)00028-0Search in ResearchGate
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Mindat Ref. ID6586294Long-form Identifiermindat:1:5:6586294:4
GUID0
Full ReferenceBasaran, Cemal, Chandaroy, Rumpa (2000) Using finite element analysis for simulation of reliability tests on solder joints in microelectronic packaging. Computers & Structures, 74. 215-231 doi:10.1016/s0045-7949(99)00028-0
Plain TextBasaran, Cemal, Chandaroy, Rumpa (2000) Using finite element analysis for simulation of reliability tests on solder joints in microelectronic packaging. Computers & Structures, 74. 215-231 doi:10.1016/s0045-7949(99)00028-0
In(n.d.) Computers & Structures Vol. 74. Elsevier BV

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