Vote for your favorite mineral in #MinCup25! - Paddlewheelite vs. Mannardite
It's a battle of the tiny as bright green #paddlewheelite goes up against jet black #mannardite. Both are small yet mighty minerals, but only one can win!
Log InRegister
Quick Links : The Mindat ManualThe Rock H. Currier Digital LibraryMindat Newsletter [Free Download]
Home PageAbout MindatThe Mindat ManualHistory of MindatCopyright StatusWho We AreContact UsAdvertise on Mindat
Donate to MindatCorporate SponsorshipSponsor a PageSponsored PagesMindat AdvertisersAdvertise on Mindat
Learning CenterWhat is a mineral?The most common minerals on earthInformation for EducatorsMindat ArticlesThe ElementsThe Rock H. Currier Digital LibraryGeologic Time
Minerals by PropertiesMinerals by ChemistryAdvanced Locality SearchRandom MineralRandom LocalitySearch by minIDLocalities Near MeSearch ArticlesSearch GlossaryMore Search Options
Search For:
Mineral Name:
Locality Name:
Keyword(s):
 
The Mindat ManualAdd a New PhotoRate PhotosLocality Edit ReportCoordinate Completion ReportAdd Glossary Item
Mining CompaniesStatisticsUsersMineral MuseumsClubs & OrganizationsMineral Shows & EventsThe Mindat DirectoryDevice SettingsThe Mineral Quiz
Photo SearchPhoto GalleriesSearch by ColorNew Photos TodayNew Photos YesterdayMembers' Photo GalleriesPast Photo of the Day GalleryPhotography

TSUCHIDA, Tetsuyuki, OKUBO, Toshikazu, KANO, Takahiro, SHOHJI, Ikuo (2013) The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint. Journal of Smart Processing, 2 (1). 22-25 doi:10.7791/jspmee.2.22

Advanced
   -   Only viewable:
Reference TypeJournal (article/letter/editorial)
TitleThe Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint
JournalJournal of Smart Processing
AuthorsTSUCHIDA, TetsuyukiAuthor
OKUBO, ToshikazuAuthor
KANO, TakahiroAuthor
SHOHJI, IkuoAuthor
Year2013Volume2
Issue1
PublisherSumart Processing Society for Minerals, Environment and Energy
DOIdoi:10.7791/jspmee.2.22Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7742906Long-form Identifiermindat:1:5:7742906:1
GUID0
Full ReferenceTSUCHIDA, Tetsuyuki, OKUBO, Toshikazu, KANO, Takahiro, SHOHJI, Ikuo (2013) The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint. Journal of Smart Processing, 2 (1). 22-25 doi:10.7791/jspmee.2.22
Plain TextTSUCHIDA, Tetsuyuki, OKUBO, Toshikazu, KANO, Takahiro, SHOHJI, Ikuo (2013) The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint. Journal of Smart Processing, 2 (1). 22-25 doi:10.7791/jspmee.2.22
In(2013) Journal of Smart Processing Vol. 2 (1) Sumart Processing Society for Minerals, Environment and Energy

See Also

These are possibly similar items as determined by title/reference text matching only.

EJIRI, Yoshinori, NOUDOU, Takaaki, TAKAHASHI, Akio, SAKURAI, Takehisa, ARAYAMA, Yoshinori, TSUBOMATSU, Yoshiaki, HASEGAWA, Kiyoshi (2016) A Study of Solder Ball Joint Reliability of Electroless Ni/Pd/Au Plating － Influence of Electroless Pd Plating Film Thickness－. Journal of Smart Processing, 5 (4). 221-228 doi:10.7791/jspmee.5.221
NAKATA, Yusuke, HASHIMOTO, Tomihito, HAYASHI, Yawara, SHOHJI, Ikuo (2016) IMC Pillar Dispersed Lead-free Solder Joint. Journal of Smart Processing, 5 (5). 309-314 doi:10.7791/jspmee.5.309
KOBAYASHI, Tatsuya, PHAM, Thai Anh, SHOHJI, Ikuo (2024) Evaluation of Adhesion on Three-Dimensional Structured Film Formed by Plating and Dealloying with Cu-Ni Alloy Plating Solution. Journal of Smart Processing, 13 (6). doi:10.7791/jspmee.13.301
YORITA, Chiko, HARADA, Masahide, NISHIKAWA, Toru, KOBAYASHI, Tatsuya, SHOHJI, Ikuo (2014) Sn-W Structure Produced at the Interface Between Sn-3Ag-0.5Cu Solder and Plating Metallization on W Substrate. Journal of Smart Processing, 3 (4). 232-239 doi:10.7791/jspmee.3.232
SHI, Kangdao, TSUNODA, Takahiro, KUSUMOTO, Kazuomi, SHOHJI, Ikuo, MATSU, Kotaro, TAGUCHI, Yasuhiro (2015) Joint Strength of SUS304 Stainless Steel Joint Brazed with Fe-Cr System Alloy. Journal of Smart Processing, 4 (5). 247-253 doi:10.7791/jspmee.4.247
Shohji, Ikuo, Goto, Hiroki, Nakamura, Kiyotomo, Ookubo, Toshikazu (2005) Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint. MATERIALS TRANSACTIONS, 46 (12). 2725-2729 doi:10.2320/matertrans.46.2725
SHI, Kangdao, TSUNODA, Takahiro, KUSUMOTO, Kazuomi, SHOHJI, Ikuo, MATSU, Kotaro, TAGUCHI, Yasuhiro (2015) Evaluation of Corrosion Resistance of SUS304 Stainless Steel Joint Brazed with Fe-Cr System Alloy. Journal of Smart Processing, 4 (4). 215-221 doi:10.7791/jspmee.4.215
MITSUI, Kohei, SHOHJI, Ikuo, KOBAYASHI, Tatsuya, WATANABE, Hirohiko (2019) Effect of Addition of Trace Ni and Ge into Sn-Sb-Ag High Temperature Lead-free Solder Alloy on its Mechanical Properties. Journal of Smart Processing, 9 (3) 133-139 doi:10.7791/jspmee.9.133
HONMA, Hidekazu, KITAHARA, Yuuhei, KANG, Joonhaeng (2020) Effect of Ni Content in the Electroless Copper Plating Film on Recrystallization at the Bottom of via in Printed Circuit Board. Journal of Smart Processing, 9 (5) 210-215 doi:10.7791/jspmee.9.210
SAITO, Akira (2016) A Study of SnO Whiskers on Sn Plating or on Pb Free Solder. Journal of Smart Processing, 5 (5). 288-293 doi:10.7791/jspmee.5.288
MITSUGI, Hironao, SUZUKI, Riku, SHOHJI, Ikuo, KOBAYASHI, Tatsuya (2021) Deterioration Behavior of Epoxy Resin for Electronics Packaging and Its Adhesive Joint with Ni by Water Absorption. Journal of Smart Processing, 10 (6) 359-364 doi:10.7791/jspmee.10.359
 
and/or  
Mindat.org is an outreach project of the Hudson Institute of Mineralogy, a 501(c)(3) not-for-profit organization.
Copyright © mindat.org and the Hudson Institute of Mineralogy 1993-2025, except where stated. Most political location boundaries are © OpenStreetMap contributors. Mindat.org relies on the contributions of thousands of members and supporters. Founded in 2000 by Jolyon Ralph.
To cite: Ralph, J., Von Bargen, D., Martynov, P., Zhang, J., Que, X., Prabhu, A., Morrison, S. M., Li, W., Chen, W., & Ma, X. (2025). Mindat.org: The open access mineralogy database to accelerate data-intensive geoscience research. American Mineralogist, 110(6), 833–844. doi:10.2138/am-2024-9486.
Privacy Policy - Terms & Conditions - Contact Us / DMCA issues - Report a bug/vulnerability Current server date and time: September 16, 2025 00:43:54
Go to top of page