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Yu, Chong-Hee, Kim, Kyung-Seob, Sun, Yong-Bin, Kim, Nam-Kyu, Kim, Nam-Hoon, Oh, Heang-Suk, Chang, Eui-Goo (2002) Aging Treatment Characteristics of Shear Strength in Micro Solder Bump. MATERIALS TRANSACTIONS, 43 (12). 3234-3238 doi:10.2320/matertrans.43.3234

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Reference TypeJournal (article/letter/editorial)
TitleAging Treatment Characteristics of Shear Strength in Micro Solder Bump
JournalMATERIALS TRANSACTIONS
AuthorsYu, Chong-HeeAuthor
Kim, Kyung-SeobAuthor
Sun, Yong-BinAuthor
Kim, Nam-KyuAuthor
Kim, Nam-HoonAuthor
Oh, Heang-SukAuthor
Chang, Eui-GooAuthor
Year2002Volume43
Issue12
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.43.3234Search in ResearchGate
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Mindat Ref. ID7776290Long-form Identifiermindat:1:5:7776290:2
GUID0
Full ReferenceYu, Chong-Hee, Kim, Kyung-Seob, Sun, Yong-Bin, Kim, Nam-Kyu, Kim, Nam-Hoon, Oh, Heang-Suk, Chang, Eui-Goo (2002) Aging Treatment Characteristics of Shear Strength in Micro Solder Bump. MATERIALS TRANSACTIONS, 43 (12). 3234-3238 doi:10.2320/matertrans.43.3234
Plain TextYu, Chong-Hee, Kim, Kyung-Seob, Sun, Yong-Bin, Kim, Nam-Kyu, Kim, Nam-Hoon, Oh, Heang-Suk, Chang, Eui-Goo (2002) Aging Treatment Characteristics of Shear Strength in Micro Solder Bump. MATERIALS TRANSACTIONS, 43 (12). 3234-3238 doi:10.2320/matertrans.43.3234
In(2002) MATERIALS TRANSACTIONS Vol. 43 (12) Japan Institute of Metals

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