| Reference Type | Journal (article/letter/editorial) |
|---|
| Title | Residual Stress of TiNi Shape Memory Alloy Thin Films with (111) Single-crystal Silicon Wafer |
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| Journal | MATERIALS TRANSACTIONS |
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| Authors | Wu, Tingbin | Author |
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| Jiang, Bohong | Author |
| Qi, Xuan | Author |
| Liu, Yushu | Author |
| Xu, Dong | Author |
| Wang, Li | Author |
| Year | 2002 | Volume | 43 |
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| Issue | 3 |
|---|
| Publisher | Japan Institute of Metals |
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| DOI | doi:10.2320/matertrans.43.566Search in ResearchGate |
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| Generate Citation Formats |
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| Mindat Ref. ID | 7776388 | Long-form Identifier | mindat:1:5:7776388:6 |
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|
| GUID | 0 |
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| Full Reference | Wu, Tingbin, Jiang, Bohong, Qi, Xuan, Liu, Yushu, Xu, Dong, Wang, Li (2002) Residual Stress of TiNi Shape Memory Alloy Thin Films with (111) Single-crystal Silicon Wafer. MATERIALS TRANSACTIONS, 43 (3). 566-570 doi:10.2320/matertrans.43.566 |
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| Plain Text | Wu, Tingbin, Jiang, Bohong, Qi, Xuan, Liu, Yushu, Xu, Dong, Wang, Li (2002) Residual Stress of TiNi Shape Memory Alloy Thin Films with (111) Single-crystal Silicon Wafer. MATERIALS TRANSACTIONS, 43 (3). 566-570 doi:10.2320/matertrans.43.566 |
|---|
| In | (2002) MATERIALS TRANSACTIONS Vol. 43 (3) Japan Institute of Metals |
|---|
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