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Natsume, Yukinobu, Ohsasa, Kenichi, Narita, Toshio (2003) Phase-field Simulation of Transient Liquid Phase Bonding Process of Ni Using Ni-P Binary Filler Metal. MATERIALS TRANSACTIONS, 44 (5). 819-823 doi:10.2320/matertrans.44.819

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Reference TypeJournal (article/letter/editorial)
TitlePhase-field Simulation of Transient Liquid Phase Bonding Process of Ni Using Ni-P Binary Filler Metal
JournalMATERIALS TRANSACTIONS
AuthorsNatsume, YukinobuAuthor
Ohsasa, KenichiAuthor
Narita, ToshioAuthor
Year2003Volume44
Issue5
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.44.819Search in ResearchGate
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Mindat Ref. ID7776998Long-form Identifiermindat:1:5:7776998:7
GUID0
Full ReferenceNatsume, Yukinobu, Ohsasa, Kenichi, Narita, Toshio (2003) Phase-field Simulation of Transient Liquid Phase Bonding Process of Ni Using Ni-P Binary Filler Metal. MATERIALS TRANSACTIONS, 44 (5). 819-823 doi:10.2320/matertrans.44.819
Plain TextNatsume, Yukinobu, Ohsasa, Kenichi, Narita, Toshio (2003) Phase-field Simulation of Transient Liquid Phase Bonding Process of Ni Using Ni-P Binary Filler Metal. MATERIALS TRANSACTIONS, 44 (5). 819-823 doi:10.2320/matertrans.44.819
In(2003) MATERIALS TRANSACTIONS Vol. 44 (5) Japan Institute of Metals

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Shinmura, Toshiyasu, Ohsasa, Kenichi, Narita, Toshio (2001) Isothermal Solidification Behavior During the Transient Liquid Phase Bonding Process of Nickel Using Binary Filler Metals. MATERIALS TRANSACTIONS, 42 (2). 292-297 doi:10.2320/matertrans.42.292
Natsume, Yukinobu, Ohsasa, Kenichi, Esaka, Hisao, Narita, Toshio (2003) Analysis of Growth Behavior of a Cellular and Dendritic Interface under a Constrained Growth Condition using a Phase-Field Model. MATERIALS TRANSACTIONS, 44 (5). 824-828 doi:10.2320/matertrans.44.824
Natsume, Yukinobu, Ohsasa, Kenichi, Narita, Toshio (2002) Investigation of the Mechanism of Alloy Dendrite Deflection due to Flowing Melt by Phase-Field Simulation. MATERIALS TRANSACTIONS, 43 (9). 2228-2234 doi:10.2320/matertrans.43.2228
Ohsasa, K., Narita, T., Shinmura, T. (1999) Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal. Journal of Phase Equilibria, 20 (3) 199-206 doi:10.1361/105497199770335721
Rhee, Byongho, Roh, Sungjoo, Kim, Dohyang (2003) Transient Liquid Phase Bonding of Nitrogen Containing Duplex Stainless Steel UNS S31803 Using Ni-Cr-Fe-Si-B Insert Metal. MATERIALS TRANSACTIONS, 44 (5). 1014-1023 doi:10.2320/matertrans.44.1014
Ohsasa, Kenichi, Hirata, Atsushi, Uchida, Misako, Itami, Toshio (2003) Numerical Analysis of Solidification Effect on Diffusion Measurement in Liquid using the Long Capillary Method. MATERIALS TRANSACTIONS, 44 (6). 1068-1074 doi:10.2320/matertrans.44.1068
Esaka, Hisao, Daimon, Hiroyasu, Natsume, Yukinobu, Ohsasa, Kenichi, Tamura, Manabu (2002) Growth Direction of Cellular and Dendritic Interface in a Constrained Growth Condition. MATERIALS TRANSACTIONS, 43 (6). 1312-1317 doi:10.2320/matertrans.43.1312
Yamaguchi, Kenichi, Ishida, Shoji, Asano, Setsuro (2003) Valence Electron Concentration and Phase Transformations of Shape Memory Alloys Ni-Mn-Ga-X. MATERIALS TRANSACTIONS, 44 (1). 204-210 doi:10.2320/matertrans.44.204
Koyama, Toshiyuki, Hashimoto, Kiyoshi, Onodera, Hidehiro (2006) Phase-Field Simulation of Phase Transformation in Fe-Cu-Mn-Ni Quaternary Alloy. MATERIALS TRANSACTIONS, 47 (11). 2765-2772 doi:10.2320/matertrans.47.2765
Jalilian, F., Jahazi, M., Drew, R.A.L. (2006) Microstructural evolution during transient liquid phase bonding of Inconel 617 using Ni–Si–B filler metal. Materials Science and Engineering: A, 423. 269-281 doi:10.1016/j.msea.2006.02.030
Jabbari, Farzin, Ekrami, Aliakbar (2022) Conventional vs. Temperature-Gradient Transient Liquid Phase Bonding of Stainless Steel 304 Using a Multi-component (Fe–Ni–Mo–B) Filler Metal. Metallurgical and Materials Transactions A, 53 (11) 4081-4100 doi:10.1007/s11661-022-06817-9
 
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