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Takaku, Yoshikazu, Liu, Xing Jun, Ohnuma, Ikuo, Kainuma, Ryosuke, Ishida, Kiyohito (2004) Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate. MATERIALS TRANSACTIONS, 45 (3). 646-651 doi:10.2320/matertrans.45.646

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Reference TypeJournal (article/letter/editorial)
TitleInterfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate
JournalMATERIALS TRANSACTIONS
AuthorsTakaku, YoshikazuAuthor
Liu, Xing JunAuthor
Ohnuma, IkuoAuthor
Kainuma, RyosukeAuthor
Ishida, KiyohitoAuthor
Year2004Volume45
Issue3
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.646Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7777370Long-form Identifiermindat:1:5:7777370:4
GUID0
Full ReferenceTakaku, Yoshikazu, Liu, Xing Jun, Ohnuma, Ikuo, Kainuma, Ryosuke, Ishida, Kiyohito (2004) Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate. MATERIALS TRANSACTIONS, 45 (3). 646-651 doi:10.2320/matertrans.45.646
Plain TextTakaku, Yoshikazu, Liu, Xing Jun, Ohnuma, Ikuo, Kainuma, Ryosuke, Ishida, Kiyohito (2004) Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate. MATERIALS TRANSACTIONS, 45 (3). 646-651 doi:10.2320/matertrans.45.646
In(2004) MATERIALS TRANSACTIONS Vol. 45 (3) Japan Institute of Metals

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