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Kariya, Yoshiharu, Hosoi, Takuya, Kimura, Takashi, Terashima, Shinichi, Tanaka, Masamoto (2004) Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects. MATERIALS TRANSACTIONS, 45 (3). 689-694 doi:10.2320/matertrans.45.689

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Reference TypeJournal (article/letter/editorial)
TitleLow Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects
JournalMATERIALS TRANSACTIONS
AuthorsKariya, YoshiharuAuthor
Hosoi, TakuyaAuthor
Kimura, TakashiAuthor
Terashima, ShinichiAuthor
Tanaka, MasamotoAuthor
Year2004Volume45
Issue3
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.689Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7777376Long-form Identifiermindat:1:5:7777376:8
GUID0
Full ReferenceKariya, Yoshiharu, Hosoi, Takuya, Kimura, Takashi, Terashima, Shinichi, Tanaka, Masamoto (2004) Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects. MATERIALS TRANSACTIONS, 45 (3). 689-694 doi:10.2320/matertrans.45.689
Plain TextKariya, Yoshiharu, Hosoi, Takuya, Kimura, Takashi, Terashima, Shinichi, Tanaka, Masamoto (2004) Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects. MATERIALS TRANSACTIONS, 45 (3). 689-694 doi:10.2320/matertrans.45.689
In(2004) MATERIALS TRANSACTIONS Vol. 45 (3) Japan Institute of Metals

See Also

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Terashima, Shinichi, Kariya, Yoshiharu, Tanaka, Masamoto (2004) Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition. MATERIALS TRANSACTIONS, 45 (3). 673-680 doi:10.2320/matertrans.45.673
Terashima, Shinichi, Tanaka, Masamoto (2004) Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects. MATERIALS TRANSACTIONS, 45 (3). 681-688 doi:10.2320/matertrans.45.681
Terashima, Shinichi, Takahama, Keiko, Nozaki, Masako, Tanaka, Masamoto (2004) Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder. MATERIALS TRANSACTIONS, 45 (4). 1383-1390 doi:10.2320/matertrans.45.1383
Kariya, Yoshiharu, Niimi, Tomokazu, Suga, Tadatomo, Otsuka, Masahisa (2005) Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen. MATERIALS TRANSACTIONS, 46 (11). 2309-2315 doi:10.2320/matertrans.46.2309
Kanda, Yoshihiko, Kariya, Yoshiharu, Mochizuki, Yusuke (2008) Effect of Hold Time on Low Cycle Fatigue Life of Micro Solder Joint. MATERIALS TRANSACTIONS, 49 (7). 1524-1530 doi:10.2320/matertrans.mf200852
Maeshima, Takashi, Nishida, Minoru (2004) Shape Memory Properties of Biomedical Ti-Mo-Ag and Ti-Mo-Sn Alloys. MATERIALS TRANSACTIONS, 45 (4). 1096-1100 doi:10.2320/matertrans.45.1096
Lee, Joonho, Shimoda, Wataru, Tanaka, Toshihiro (2004) Surface Tension and its Temperature Coefficient of Liquid Sn-X (X=Ag, Cu) Alloys. MATERIALS TRANSACTIONS, 45 (9). 2864-2870 doi:10.2320/matertrans.45.2864
Lee, Joonho, Tanaka, Toshihiro, Yamamoto, Masaya, Hara, Shigeta (2004) Effect of Oxygen on Surface Tension of Liquid Ag-Sn Alloys. MATERIALS TRANSACTIONS, 45 (3). 625-629 doi:10.2320/matertrans.45.625
Kariya, Yoshiharu, Kanda, Yoshihiko, Iguchi, Keitaro, Furusawa, Hiromitsu (2010) Influence of Temperature and Dwelling Time on Low-Cycle Fatigue Characteristic of Isotropic Conductive Adhesive Joint. MATERIALS TRANSACTIONS, 51 (10). 1779-1784 doi:10.2320/matertrans.mj201018
Kimura, Ryo, Kariya, Yoshiharu, Mizumura, Noritsuka, Sasaki, Koji (2018) Effect of Sintering Temperature on Fatigue Crack Propagation Rate of Sintered Ag Nanoparticles. MATERIALS TRANSACTIONS, 59 (4). 612-619 doi:10.2320/matertrans.m2017392
Yoon, Jeong-Won, Kim, Sang-Won, Jung, Seung-Boo (2004) IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging. MATERIALS TRANSACTIONS, 45 (3). 727-733 doi:10.2320/matertrans.45.727
 
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