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Lee, Jaesik, Bang, Woongho, Jung, Jaepil, Oh, Kyuhwan (2004) Microstructure and Strength of Sn-Bi Coated Sn-3.5 mass%Ag Solder Alloy. MATERIALS TRANSACTIONS, 45 (3). 783-789 doi:10.2320/matertrans.45.783

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Reference TypeJournal (article/letter/editorial)
TitleMicrostructure and Strength of Sn-Bi Coated Sn-3.5 mass%Ag Solder Alloy
JournalMATERIALS TRANSACTIONS
AuthorsLee, JaesikAuthor
Bang, WoonghoAuthor
Jung, JaepilAuthor
Oh, KyuhwanAuthor
Year2004Volume45
Issue3
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.783Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7777390Long-form Identifiermindat:1:5:7777390:8
GUID0
Full ReferenceLee, Jaesik, Bang, Woongho, Jung, Jaepil, Oh, Kyuhwan (2004) Microstructure and Strength of Sn-Bi Coated Sn-3.5 mass%Ag Solder Alloy. MATERIALS TRANSACTIONS, 45 (3). 783-789 doi:10.2320/matertrans.45.783
Plain TextLee, Jaesik, Bang, Woongho, Jung, Jaepil, Oh, Kyuhwan (2004) Microstructure and Strength of Sn-Bi Coated Sn-3.5 mass%Ag Solder Alloy. MATERIALS TRANSACTIONS, 45 (3). 783-789 doi:10.2320/matertrans.45.783
In(2004) MATERIALS TRANSACTIONS Vol. 45 (3) Japan Institute of Metals

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Lee, Chang-Bae, Lee, In-Young, Jung, Seung-Boo, Shur, Chang-Chae (2002) Effect of Surface Finishes on Ball Shear Strength in BGA Joints with Sn-3.5 mass%Ag Solder. MATERIALS TRANSACTIONS, 43 (4). 751-756 doi:10.2320/matertrans.43.751
Hong, Soon-Min, Kang, Choon-Sik, Jung, Jae-Pil (2002) Fluxless Sn-3.5 mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave. MATERIALS TRANSACTIONS, 43 (6). 1336-1340 doi:10.2320/matertrans.43.1336
Yoon, Jeong-Won, Kim, Sang-Won, Jung, Seung-Boo (2004) IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging. MATERIALS TRANSACTIONS, 45 (3). 727-733 doi:10.2320/matertrans.45.727
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Park, Chang-Bae, Hong, Soon-Min, Jung, Jae-Pil, Kang, Choon-Sik, Shin, Yong-Eui (2001) A Study on the Fluxless Soldering of Si-Wafer/Glass Substrate Using Sn-3.5 mass%Ag and Sn-37 mass%Pb Solder. MATERIALS TRANSACTIONS, 42 (5). 820-824 doi:10.2320/matertrans.42.820
Miyazawa, Yasuyuki, Ariga, Tadashi (2001) Influences of Aging Treatment on Microstructure and Hardness of Sn-(Ag, Bi, Zn) Eutectic Solder Alloys. MATERIALS TRANSACTIONS, 42 (5). 776-782 doi:10.2320/matertrans.42.776
Choi, Jin-Won, Cha, Ho-Seob, Oh, Tae-Sung (2002) Mechanical Properties and Shear Strength of Sn-3.5Ag-Bi Solder Alloys. MATERIALS TRANSACTIONS, 43 (8). 1864-1867 doi:10.2320/matertrans.43.1864
Takao, Hisaaki, Hasegawa, Hideo (2004) Influence of Noble Metal Coating on Wettability of Copper Substrate by Sn-Ag Eutectic Solder. MATERIALS TRANSACTIONS, 45 (3). 747-753 doi:10.2320/matertrans.45.747
Yoon, Jeong-Won, Lee, Chang-Bae, Jung, Seung-Boo (2002) Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate. MATERIALS TRANSACTIONS, 43 (8). 1821-1826 doi:10.2320/matertrans.43.1821
Yamaguchi, Atsushi, Yamashita, Yuhei, Furusawa, Akio, Nishida, Kazuto, Hojo, Takashi, Sogo, Yosuke, Miwa, Ayako, Hirose, Akio, Kobayashi, Kojiro F. (2004) Properties of Solder Joints Using Sn-Ag-Bi-In Solder. MATERIALS TRANSACTIONS, 45 (4). 1282-1289 doi:10.2320/matertrans.45.1282
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