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Kim, Dae-Gon, Jung, Seung-Boo (2005) Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method. MATERIALS TRANSACTIONS, 46 (11). 2366-2371 doi:10.2320/matertrans.46.2366

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Reference TypeJournal (article/letter/editorial)
TitleMicrostructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
JournalMATERIALS TRANSACTIONS
AuthorsKim, Dae-GonAuthor
Jung, Seung-BooAuthor
Year2005Volume46
Issue11
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.46.2366Search in ResearchGate
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Mindat Ref. ID7777841Long-form Identifiermindat:1:5:7777841:7
GUID0
Full ReferenceKim, Dae-Gon, Jung, Seung-Boo (2005) Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method. MATERIALS TRANSACTIONS, 46 (11). 2366-2371 doi:10.2320/matertrans.46.2366
Plain TextKim, Dae-Gon, Jung, Seung-Boo (2005) Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method. MATERIALS TRANSACTIONS, 46 (11). 2366-2371 doi:10.2320/matertrans.46.2366
In(2005) MATERIALS TRANSACTIONS Vol. 46 (11) Japan Institute of Metals

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Kim, Dae-Gon, Jung, Seung-Boo (2005) Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn–3.0Ag–0.5Cu Solder and Ni–P under Bump Metallurgy. MATERIALS TRANSACTIONS, 46 (6). 1295-1300 doi:10.2320/matertrans.46.1295
Lee, Jaesik, Jung, Jae-Pil, Cheon, Chu-Seon, Zhou, Yunhong, Mayer, Michael (2005) Flip Chip Bump Formation of Sn–1.8Bi–0.8Cu–0.6In Solder by Stencil Printing. MATERIALS TRANSACTIONS, 46 (11). 2359-2365 doi:10.2320/matertrans.46.2359
Yoon, Jeong-Won, Chun, Hyun-Suk, Jung, Seung-Boo (2005) Interfacial Reaction and Mechanical Characterization of Eutectic Sn–Zn/ENIG Solder Joints during Reflow and Aging. MATERIALS TRANSACTIONS, 46 (11). 2386-2393 doi:10.2320/matertrans.46.2386
Kim, Dae Gon, Ha, Sang Su, Jung, Seung Boo (2006) Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps. Materials Science Forum, 510. 550-553 doi:10.4028/www.scientific.net/msf.510-511.550
Kim, Jong-Woong, Kim, Dae-Gon, Jung, Seung-Boo (2005) Mechanical strength test method for solder ball joint in BGA package. Metals and Materials International, 11. 121-129 doi:10.1007/bf03027455
Koo, Ja-Myeong, Kim, Yu-Na, Yoon, Jeong-Won, Kim, Dae-Gon, Noh, Bo-In, Kim, Jong-Woong, Moon, Jung-Hoon, Jung, Seung-Boo (2008) Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages. Materials Science and Engineering: A, 483. 620-624 doi:10.1016/j.msea.2006.11.164
Kim, Dae Gon, Jang, Hyung Sun, Kim, Jong Woong, Jung, Seung Boo (2005) Investigations of Interfacial Reaction and Shear Strength between Pb-Free Flip Chip Solder and Electroplated Cu UBM. Key Engineering Materials, 297. 863-868 doi:10.4028/www.scientific.net/kem.297-300.863
Kim, Dae-Gon, Kim, Jong-Woong, Lee, Jung-Goo, Mori, Hirotaro, Quesnel, David J., Jung, Seung-Boo (2005) Solid state interfacial reaction and joint strength of Sn–37Pb solder with Ni–P under bump metallization in flip chip application. Journal of Alloys and Compounds, 395. 80-87 doi:10.1016/j.jallcom.2004.11.038
Kim, Dae Gon, Jang, Hyung Sun, Kim, Young Jig, Jung, Seung Boo (2005) Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging. Materials Science Forum, 486. 273-276 doi:10.4028/www.scientific.net/msf.486-487.273
Yu, Qiang, Jin, Jae-Chul, Kim, Do-Seop, Shiratori, Masaki (2005) Fatigue Reliability Evaluation for Sn–Zn–Bi and Sn–Zn Lead-Free Solder Joints. MATERIALS TRANSACTIONS, 46 (11). 2316-2321 doi:10.2320/matertrans.46.2316
Takahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, Kamiya, Osamu (2005) Fatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders. MATERIALS TRANSACTIONS, 46 (11). 2335-2343 doi:10.2320/matertrans.46.2335
 
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