Vote for your favorite mineral in #MinCup25! - Calcite vs. Perovskite
This match of heavy hitters is bound to end in heartbreak as classic calcite faces off against futuristic perovskite.
Log InRegister
Quick Links : The Mindat ManualThe Rock H. Currier Digital LibraryMindat Newsletter [Free Download]
Home PageAbout MindatThe Mindat ManualHistory of MindatCopyright StatusWho We AreContact UsAdvertise on Mindat
Donate to MindatCorporate SponsorshipSponsor a PageSponsored PagesMindat AdvertisersAdvertise on Mindat
Learning CenterWhat is a mineral?The most common minerals on earthInformation for EducatorsMindat ArticlesThe ElementsThe Rock H. Currier Digital LibraryGeologic Time
Minerals by PropertiesMinerals by ChemistryAdvanced Locality SearchRandom MineralRandom LocalitySearch by minIDLocalities Near MeSearch ArticlesSearch GlossaryMore Search Options
Search For:
Mineral Name:
Locality Name:
Keyword(s):
 
The Mindat ManualAdd a New PhotoRate PhotosLocality Edit ReportCoordinate Completion ReportAdd Glossary Item
Mining CompaniesStatisticsUsersMineral MuseumsClubs & OrganizationsMineral Shows & EventsThe Mindat DirectoryDevice SettingsThe Mineral Quiz
Photo SearchPhoto GalleriesSearch by ColorNew Photos TodayNew Photos YesterdayMembers' Photo GalleriesPast Photo of the Day GalleryPhotography

Kim, Sung Soo, Kim, Jong Hoon, Booh, Seong Woon, Kim, Tae-Gyu, Lee, Hyuck Mo (2005) Microstructural Evolution of Joint Interface between Eutectic 80Au–20Sn Solder and UBM. MATERIALS TRANSACTIONS, 46 (11). 2400-2405 doi:10.2320/matertrans.46.2400

Advanced
   -   Only viewable:
Reference TypeJournal (article/letter/editorial)
TitleMicrostructural Evolution of Joint Interface between Eutectic 80Au–20Sn Solder and UBM
JournalMATERIALS TRANSACTIONS
AuthorsKim, Sung SooAuthor
Kim, Jong HoonAuthor
Booh, Seong WoonAuthor
Kim, Tae-GyuAuthor
Lee, Hyuck MoAuthor
Year2005Volume46
Issue11
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.46.2400Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7777846Long-form Identifiermindat:1:5:7777846:2
GUID0
Full ReferenceKim, Sung Soo, Kim, Jong Hoon, Booh, Seong Woon, Kim, Tae-Gyu, Lee, Hyuck Mo (2005) Microstructural Evolution of Joint Interface between Eutectic 80Au–20Sn Solder and UBM. MATERIALS TRANSACTIONS, 46 (11). 2400-2405 doi:10.2320/matertrans.46.2400
Plain TextKim, Sung Soo, Kim, Jong Hoon, Booh, Seong Woon, Kim, Tae-Gyu, Lee, Hyuck Mo (2005) Microstructural Evolution of Joint Interface between Eutectic 80Au–20Sn Solder and UBM. MATERIALS TRANSACTIONS, 46 (11). 2400-2405 doi:10.2320/matertrans.46.2400
In(2005) MATERIALS TRANSACTIONS Vol. 46 (11) Japan Institute of Metals

See Also

These are possibly similar items as determined by title/reference text matching only.

Choi, Jae-Hoon, Lee, Kwang-Yong, Jun, Sung-Woo, Kim, Young-Ho, Oh, Tae-Sung (2005) Contact Resistance of the Chip-on-Glass Bonded 48Sn–52In Solder Joint. MATERIALS TRANSACTIONS, 46 (5). 1042-1046 doi:10.2320/matertrans.46.1042
Kim, Hyun You, Lee, Sung Hoon, Kim, Hyoung Gyu, Ryu, Ji Hoon, Lee, Hyuck Mo (2007) Molecular Dynamic Simulation of Coalescence between Silver and Palladium Clusters. MATERIALS TRANSACTIONS, 48 (3). 455-459 doi:10.2320/matertrans.48.455
Yang, Chang Joon, Cho, Moon Gi, Lee, Hyuck Mo (2008) Synthesis of the Combination Solder of 80Au-20Sn/42Sn-58Bi and Thermodynamic Interpretation of the Microstructural Evolution. MATERIALS TRANSACTIONS, 49 (2). 376-381 doi:10.2320/matertrans.mra2007195
Kim, Jong Hoon, Jeong, Sang Won, Lee, Hyuck Mo (2004) Abnormal Grain Growth of Ni3Sn4 at Sn-3.5Ag/Ni Interface. MATERIALS TRANSACTIONS, 45 (3). 710-713 doi:10.2320/matertrans.45.710
Yoon, Seung Wook, Kim, Jong Hoon, Jeong, Sang Won, Lee, Hyuck Mo (2003) Effect of Under Bump Metallurgy and Reflows on Shear Strength and Microstructure of Joint between Cu Substrate and Sn-36Pb-2Ag Solder Alloy. MATERIALS TRANSACTIONS, 44 (2). 290-297 doi:10.2320/matertrans.44.290
Kim, Tae Yeon, Han, Sang Soo, Lee, Hyuck Mo (2004) Nanomechanical Behavior of β-SiC Nanowire in Tension: Molecular Dynamics Simulations. MATERIALS TRANSACTIONS, 45 (5). 1442-1449 doi:10.2320/matertrans.45.1442
Lee, Jae-Ean, Kim, Keun-Soo, Suganuma, Katsuaki, Takenaka, Junichi, Hagio, Koichi (2005) Interfacial Properties of Zn–Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate. MATERIALS TRANSACTIONS, 46 (11). 2413-2418 doi:10.2320/matertrans.46.2413
Kim, Sang Hoon, Kim, Yong-Jin, Lim, Tae-Soo, Yang, Dong-Yeol, Yang, Sangsun (2014) Reduced Electrical Resistivity of Ternary Solder Alloy of Tin–Copper–Sulfur: An Anti-Oxidative Role of Sulfur in Binary Solder Alloy of Tin–Copper. MATERIALS TRANSACTIONS, 55 (9). 1513-1516 doi:10.2320/matertrans.m2014102
Yu, Qiang, Jin, Jae-Chul, Kim, Do-Seop, Shiratori, Masaki (2005) Fatigue Reliability Evaluation for Sn–Zn–Bi and Sn–Zn Lead-Free Solder Joints. MATERIALS TRANSACTIONS, 46 (11). 2316-2321 doi:10.2320/matertrans.46.2316
Cho, Sun-Yun, Lee, Young-Woo, Kim, Kyoo-Seok, Moon, Young-Jun, Lee, Ji-Won., Han, Hyun-Joo, Kim, Mi-Jin, Jung, Jae-Pil (2005) Reliability of Sn–8 mass%Zn–3 mass%Bi Lead-Free Solder and Zn Behavior. MATERIALS TRANSACTIONS, 46 (11). 2322-2328 doi:10.2320/matertrans.46.2322
Huh, Seok-Hwan, Kim, Keun-Soo, Suganuma, Katsuaki (2002) Effect of Au addition on Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder. MATERIALS TRANSACTIONS, 43 (2). 239-245 doi:10.2320/matertrans.43.239
 
and/or  
Mindat.org is an outreach project of the Hudson Institute of Mineralogy, a 501(c)(3) not-for-profit organization.
Copyright © mindat.org and the Hudson Institute of Mineralogy 1993-2025, except where stated. Most political location boundaries are Β© OpenStreetMap contributors. Mindat.org relies on the contributions of thousands of members and supporters. Founded in 2000 by Jolyon Ralph.
To cite: Ralph, J., Von Bargen, D., Martynov, P., Zhang, J., Que, X., Prabhu, A., Morrison, S. M., Li, W., Chen, W., & Ma, X. (2025). Mindat.org: The open access mineralogy database to accelerate data-intensive geoscience research. American Mineralogist, 110(6), 833–844. doi:10.2138/am-2024-9486.
Privacy Policy - Terms & Conditions - Contact Us / DMCA issues - Report a bug/vulnerability Current server date and time: September 4, 2025 18:44:51
Go to top of page