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Li, X. W., Wu, S. D., Wu, Y., Yasuda, H. Y., Umakoshi, Y. (2005) Surface Deformation Features in Ultrafine-Grained Copper Cyclically Stressed at Different Temperatures. MATERIALS TRANSACTIONS, 46 (12). 3077-3080 doi:10.2320/matertrans.46.3077

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Reference TypeJournal (article/letter/editorial)
TitleSurface Deformation Features in Ultrafine-Grained Copper Cyclically Stressed at Different Temperatures
JournalMATERIALS TRANSACTIONS
AuthorsLi, X. W.Author
Wu, S. D.Author
Wu, Y.Author
Yasuda, H. Y.Author
Umakoshi, Y.Author
Year2005Volume46
Issue12
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.46.3077Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7777962Long-form Identifiermindat:1:5:7777962:9
GUID0
Full ReferenceLi, X. W., Wu, S. D., Wu, Y., Yasuda, H. Y., Umakoshi, Y. (2005) Surface Deformation Features in Ultrafine-Grained Copper Cyclically Stressed at Different Temperatures. MATERIALS TRANSACTIONS, 46 (12). 3077-3080 doi:10.2320/matertrans.46.3077
Plain TextLi, X. W., Wu, S. D., Wu, Y., Yasuda, H. Y., Umakoshi, Y. (2005) Surface Deformation Features in Ultrafine-Grained Copper Cyclically Stressed at Different Temperatures. MATERIALS TRANSACTIONS, 46 (12). 3077-3080 doi:10.2320/matertrans.46.3077
In(2005) MATERIALS TRANSACTIONS Vol. 46 (12) Japan Institute of Metals

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