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Shohji, Ikuo, Watanabe, Hirohiko, Okashita, Takeshi, Osawa, Tsutomu (2008) Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode. MATERIALS TRANSACTIONS, 49 (7). 1513-1517 doi:10.2320/matertrans.mf200808

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Reference TypeJournal (article/letter/editorial)
TitleImpact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode
JournalMATERIALS TRANSACTIONS
AuthorsShohji, IkuoAuthor
Watanabe, HirohikoAuthor
Okashita, TakeshiAuthor
Osawa, TsutomuAuthor
Year2008Volume49
Issue7
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.mf200808Search in ResearchGate
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Mindat Ref. ID7779832Long-form Identifiermindat:1:5:7779832:3
GUID0
Full ReferenceShohji, Ikuo, Watanabe, Hirohiko, Okashita, Takeshi, Osawa, Tsutomu (2008) Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode. MATERIALS TRANSACTIONS, 49 (7). 1513-1517 doi:10.2320/matertrans.mf200808
Plain TextShohji, Ikuo, Watanabe, Hirohiko, Okashita, Takeshi, Osawa, Tsutomu (2008) Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode. MATERIALS TRANSACTIONS, 49 (7). 1513-1517 doi:10.2320/matertrans.mf200808
In(2008) MATERIALS TRANSACTIONS Vol. 49 (7) Japan Institute of Metals

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Shohji, Ikuo, Osawa, Tsutomu, Okashita, Takeshi, Watanabe, Hirohiko (2008) Impact Properties of Sn-0.75Cu Lead-Free Solder Ball Joint. Key Engineering Materials, 385. 745-748 doi:10.4028/www.scientific.net/kem.385-387.745
Shohji, Ikuo, Tsunoda, Satoshi, Watanabe, Hirohiko, Asai, Tatsuhiko, Nagano, Megumi (2005) Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions. MATERIALS TRANSACTIONS, 46 (12). 2737-2744 doi:10.2320/matertrans.46.2737
Shohji, Ikuo, Tsunoda, Satoshi, Watanabe, Hirohiko, Asai, Tatsuhiko (2007) Influence of Content of Ni and Ag on Microstructure and Joint Strength of Lead-Free Solder Joint with Sn-Ag-Cu-Ni-Ge. Key Engineering Materials, 353. 2033-2036 doi:10.4028/www.scientific.net/kem.353-358.2033
Watanabe, Hirohiko, Nagai, Marie, Osawa, Tsutomu, Shohji, Ikuo (2011) Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge Alloy. Key Engineering Materials, 462. 70-75 doi:10.4028/www.scientific.net/kem.462-463.70
Shohji, Ikuo, Osawa, Tsutomu, Matsuki, Takashige, Kariya, Yoshiharu, Yasuda, Kiyokazu, Takemoto, Tadashi (2008) Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders. MATERIALS TRANSACTIONS, 49 (5). 1175-1179 doi:10.2320/matertrans.mbw200705
Watanabe, Hirohiko, Shimoda, Masayoshi, Hidaka, Noboru, Shohji, Ikuo (2011) Effect of Interfacial Reaction in Sn-Ag-Cu Solder Alloy with Ni Addition. Key Engineering Materials, 462. 247-252 doi:10.4028/www.scientific.net/kem.462-463.247
MITSUI, Kohei, SHOHJI, Ikuo, KOBAYASHI, Tatsuya, WATANABE, Hirohiko (2019) Effect of Addition of Trace Ni and Ge into Sn-Sb-Ag High Temperature Lead-free Solder Alloy on its Mechanical Properties. Journal of Smart Processing, 9 (3) 133-139 doi:10.7791/jspmee.9.133
Haidong, Zhang, Shohji, Ikuo, Shimoda, Masayoshi, Watanabe, Hirohiko (2016) Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder. MATERIALS TRANSACTIONS, 57 (6). 873-880 doi:10.2320/matertrans.md201517
Hirai, Yukihiko, Oomori, Kouki, Morofushi, Hayato, Sarayama, Masaaki, Iioka, Makoto, Shohji, Ikuo (2022) Microstructure and Thermal Cycle Reliability of Sn–Ag–Cu–In–Sb Solder Joint. MATERIALS TRANSACTIONS, 63 (7) 1021-1027 doi:10.2320/matertrans.mt-mc2022013
Shohji, Ikuo, Koyama, Shinji, Oshiro, Itaru, Nara, Hideaki, Iwata, Yoshiharu (2010) Fluxless Bonding of Ni-P/Cu Plated Al Alloy and Cu Alloy with Lead-Free Sn-Cu Foil. MATERIALS TRANSACTIONS, 51 (10). 1753-1758 doi:10.2320/matertrans.mj201010
Shohji, Ikuo, Arai, Ryohei, Ishikawa, Hisao, Kojima, Masao (2011) Effect of Ag Content on Mechanical Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Alloy. Key Engineering Materials, 462. 82-87 doi:10.4028/www.scientific.net/kem.462-463.82
 
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