Kawamoto, Naoyuki, Murakami, Yasukazu, Shindo, Daisuke, Kim, Keunsoo, Suganuma, Katsuaki (2006) Advanced Transmission Electron Microscopy on Silver-Based Conductive Adhesive. Journal of the Japan Institute of Metals, 70 (4). 384-388 doi:10.2320/jinstmet.70.384
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Advanced Transmission Electron Microscopy on Silver-Based Conductive Adhesive | ||
Journal | Journal of the Japan Institute of Metals | ||
Authors | Kawamoto, Naoyuki | Author | |
Murakami, Yasukazu | Author | ||
Shindo, Daisuke | Author | ||
Kim, Keunsoo | Author | ||
Suganuma, Katsuaki | Author | ||
Year | 2006 | Volume | 70 |
Issue | 4 | ||
Publisher | Japan Institute of Metals | ||
DOI | doi:10.2320/jinstmet.70.384Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 7816263 | Long-form Identifier | mindat:1:5:7816263:1 |
GUID | 0 | ||
Full Reference | Kawamoto, Naoyuki, Murakami, Yasukazu, Shindo, Daisuke, Kim, Keunsoo, Suganuma, Katsuaki (2006) Advanced Transmission Electron Microscopy on Silver-Based Conductive Adhesive. Journal of the Japan Institute of Metals, 70 (4). 384-388 doi:10.2320/jinstmet.70.384 | ||
Plain Text | Kawamoto, Naoyuki, Murakami, Yasukazu, Shindo, Daisuke, Kim, Keunsoo, Suganuma, Katsuaki (2006) Advanced Transmission Electron Microscopy on Silver-Based Conductive Adhesive. Journal of the Japan Institute of Metals, 70 (4). 384-388 doi:10.2320/jinstmet.70.384 | ||
In | (2006) Journal of the Japan Institute of Metals Vol. 70 (4) Japan Institute of Metals |
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