Reference Type | Journal (article/letter/editorial) |
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Title | Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites |
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Journal | Transactions of Nonferrous Metals Society of China |
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Authors | WANG, Kai-kun | Author |
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WANG, Fu-yu | Author |
CHEN, Xue-jun | Author |
WANG, Lu | Author |
MA, Chun-mei | Author |
Year | 2010 (September) | Volume | 20 |
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Issue | 9 |
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Publisher | Elsevier BV |
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DOI | doi:10.1016/s1003-6326(09)60362-9Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 7848449 | Long-form Identifier | mindat:1:5:7848449:0 |
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GUID | 0 |
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Full Reference | WANG, Kai-kun, WANG, Fu-yu, CHEN, Xue-jun, WANG, Lu, MA, Chun-mei (2010) Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites. Transactions of Nonferrous Metals Society of China, 20 (9). 1707-1711 doi:10.1016/s1003-6326(09)60362-9 |
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Plain Text | WANG, Kai-kun, WANG, Fu-yu, CHEN, Xue-jun, WANG, Lu, MA, Chun-mei (2010) Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites. Transactions of Nonferrous Metals Society of China, 20 (9). 1707-1711 doi:10.1016/s1003-6326(09)60362-9 |
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In | (2010, September) Transactions of Nonferrous Metals Society of China Vol. 20 (9) Elsevier BV |
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