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GUO, Wei-bing, LUAN, Tian-min, LENG, Xue-song, HE, Jing-shan, YAN, Jiu-chun (2017) Interfacial microstructure evolution and mechanical properties of Al/Sn joints by ultrasonic-assisted soldering. Transactions of Nonferrous Metals Society of China, 27 (4). 962-970 doi:10.1016/s1003-6326(17)60112-2

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Reference TypeJournal (article/letter/editorial)
TitleInterfacial microstructure evolution and mechanical properties of Al/Sn joints by ultrasonic-assisted soldering
JournalTransactions of Nonferrous Metals Society of China
AuthorsGUO, Wei-bingAuthor
LUAN, Tian-minAuthor
LENG, Xue-songAuthor
HE, Jing-shanAuthor
YAN, Jiu-chunAuthor
Year2017 (April)Volume27
Issue4
PublisherElsevier BV
DOIdoi:10.1016/s1003-6326(17)60112-2Search in ResearchGate
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Mindat Ref. ID7851806Long-form Identifiermindat:1:5:7851806:1
GUID0
Full ReferenceGUO, Wei-bing, LUAN, Tian-min, LENG, Xue-song, HE, Jing-shan, YAN, Jiu-chun (2017) Interfacial microstructure evolution and mechanical properties of Al/Sn joints by ultrasonic-assisted soldering. Transactions of Nonferrous Metals Society of China, 27 (4). 962-970 doi:10.1016/s1003-6326(17)60112-2
Plain TextGUO, Wei-bing, LUAN, Tian-min, LENG, Xue-song, HE, Jing-shan, YAN, Jiu-chun (2017) Interfacial microstructure evolution and mechanical properties of Al/Sn joints by ultrasonic-assisted soldering. Transactions of Nonferrous Metals Society of China, 27 (4). 962-970 doi:10.1016/s1003-6326(17)60112-2
In(2017, April) Transactions of Nonferrous Metals Society of China Vol. 27 (4) Elsevier BV

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