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Yang, Jian-guang, Wu, Yong-tian, Li, Jing (2012) Recovery of ultrafine copper particles from metal components of waste printed circuit boards. Hydrometallurgy, 121. 1-6 doi:10.1016/j.hydromet.2012.04.015

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Reference TypeJournal (article/letter/editorial)
TitleRecovery of ultrafine copper particles from metal components of waste printed circuit boards
JournalHydrometallurgy
AuthorsYang, Jian-guangAuthor
Wu, Yong-tianAuthor
Li, JingAuthor
Year2012 (June)Volume121
PublisherElsevier BV
DOIdoi:10.1016/j.hydromet.2012.04.015Search in ResearchGate
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Mindat Ref. ID7890204Long-form Identifiermindat:1:5:7890204:8
GUID0
Full ReferenceYang, Jian-guang, Wu, Yong-tian, Li, Jing (2012) Recovery of ultrafine copper particles from metal components of waste printed circuit boards. Hydrometallurgy, 121. 1-6 doi:10.1016/j.hydromet.2012.04.015
Plain TextYang, Jian-guang, Wu, Yong-tian, Li, Jing (2012) Recovery of ultrafine copper particles from metal components of waste printed circuit boards. Hydrometallurgy, 121. 1-6 doi:10.1016/j.hydromet.2012.04.015
In(2012) Hydrometallurgy Vol. 121. Elsevier BV

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