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Zhu, Xiaoyun, Liu, Yuanlong, Long, Jinming, Liu, Xiaoli (2012) Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives. Rare Metals, 31. 64-70 doi:10.1007/s12598-012-0464-0

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Reference TypeJournal (article/letter/editorial)
TitleElectrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives
JournalRare Metals
AuthorsZhu, XiaoyunAuthor
Liu, YuanlongAuthor
Long, JinmingAuthor
Liu, XiaoliAuthor
Year2012 (February)Volume31
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/s12598-012-0464-0Search in ResearchGate
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Mindat Ref. ID8049269Long-form Identifiermindat:1:5:8049269:6
GUID0
Full ReferenceZhu, Xiaoyun, Liu, Yuanlong, Long, Jinming, Liu, Xiaoli (2012) Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives. Rare Metals, 31. 64-70 doi:10.1007/s12598-012-0464-0
Plain TextZhu, Xiaoyun, Liu, Yuanlong, Long, Jinming, Liu, Xiaoli (2012) Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives. Rare Metals, 31. 64-70 doi:10.1007/s12598-012-0464-0
In(2012) Rare Metals Vol. 31. Springer Science and Business Media LLC

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