Chang, Chin‐An, Baglin, J. E. E., Schrott, A. G., Lin, K. C. (1987) Enhanced Cu‐Teflon adhesion by presputtering prior to the Cu deposition. Applied Physics Letters, 51 (2). 103-105 doi:10.1063/1.98637
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Enhanced Cu‐Teflon adhesion by presputtering prior to the Cu deposition | ||
| Journal | Applied Physics Letters | ||
| Authors | Chang, Chin‐An | Author | |
| Baglin, J. E. E. | Author | ||
| Schrott, A. G. | Author | ||
| Lin, K. C. | Author | ||
| Year | 1987 (July 13) | Volume | 51 |
| Issue | 2 | ||
| Publisher | AIP Publishing | ||
| DOI | doi:10.1063/1.98637Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 8481430 | Long-form Identifier | mindat:1:5:8481430:0 |
| GUID | 0 | ||
| Full Reference | Chang, Chin‐An, Baglin, J. E. E., Schrott, A. G., Lin, K. C. (1987) Enhanced Cu‐Teflon adhesion by presputtering prior to the Cu deposition. Applied Physics Letters, 51 (2). 103-105 doi:10.1063/1.98637 | ||
| Plain Text | Chang, Chin‐An, Baglin, J. E. E., Schrott, A. G., Lin, K. C. (1987) Enhanced Cu‐Teflon adhesion by presputtering prior to the Cu deposition. Applied Physics Letters, 51 (2). 103-105 doi:10.1063/1.98637 | ||
| In | (1987, July) Applied Physics Letters Vol. 51 (2) AIP Publishing | ||
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