Ong, T. P., Fiordalice, R., Venkatraman, R., Garcia, S., Jain, A., Sparks, T., Farkas, J., Fernandes, M., Gall, M., Jawarani, D., Klein, J., Weitzman, E., Kawasaki, H., Wu, Wei, Blumenthal, R., Pintchovski, F., Marsh, R., Zhang, P., Zhang, H., Guo, T., Mosely, R. (1998) Void-free chemically vapor-deposited aluminum dual inlaid metallization schemes for ultra-large-scale-integrated via and interconnect applications. Applied Physics Letters, 73 (1). 82-84 doi:10.1063/1.121731
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Void-free chemically vapor-deposited aluminum dual inlaid metallization schemes for ultra-large-scale-integrated via and interconnect applications | ||
Journal | Applied Physics Letters | ||
Authors | Ong, T. P. | Author | |
Fiordalice, R. | Author | ||
Venkatraman, R. | Author | ||
Garcia, S. | Author | ||
Jain, A. | Author | ||
Sparks, T. | Author | ||
Farkas, J. | Author | ||
Fernandes, M. | Author | ||
Gall, M. | Author | ||
Jawarani, D. | Author | ||
Klein, J. | Author | ||
Weitzman, E. | Author | ||
Kawasaki, H. | Author | ||
Wu, Wei | Author | ||
Blumenthal, R. | Author | ||
Pintchovski, F. | Author | ||
Marsh, R. | Author | ||
Zhang, P. | Author | ||
Zhang, H. | Author | ||
Guo, T. | Author | ||
Mosely, R. | Author | ||
Year | 1998 (July 6) | Volume | 73 |
Issue | 1 | ||
Publisher | AIP Publishing | ||
DOI | doi:10.1063/1.121731Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 8521726 | Long-form Identifier | mindat:1:5:8521726:7 |
GUID | 0 | ||
Full Reference | Ong, T. P., Fiordalice, R., Venkatraman, R., Garcia, S., Jain, A., Sparks, T., Farkas, J., Fernandes, M., Gall, M., Jawarani, D., Klein, J., Weitzman, E., Kawasaki, H., Wu, Wei, Blumenthal, R., Pintchovski, F., Marsh, R., Zhang, P., Zhang, H., Guo, T., Mosely, R. (1998) Void-free chemically vapor-deposited aluminum dual inlaid metallization schemes for ultra-large-scale-integrated via and interconnect applications. Applied Physics Letters, 73 (1). 82-84 doi:10.1063/1.121731 | ||
Plain Text | Ong, T. P., Fiordalice, R., Venkatraman, R., Garcia, S., Jain, A., Sparks, T., Farkas, J., Fernandes, M., Gall, M., Jawarani, D., Klein, J., Weitzman, E., Kawasaki, H., Wu, Wei, Blumenthal, R., Pintchovski, F., Marsh, R., Zhang, P., Zhang, H., Guo, T., Mosely, R. (1998) Void-free chemically vapor-deposited aluminum dual inlaid metallization schemes for ultra-large-scale-integrated via and interconnect applications. Applied Physics Letters, 73 (1). 82-84 doi:10.1063/1.121731 | ||
In | (1998, July) Applied Physics Letters Vol. 73 (1) AIP Publishing |
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