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Hau-Riege, C. S., Thompson, C. V. (2000) Use of scanned laser annealing to control the bamboo grain length of Cu interconnects. Applied Physics Letters, 77 (3). 352-354 doi:10.1063/1.126973

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Reference TypeJournal (article/letter/editorial)
TitleUse of scanned laser annealing to control the bamboo grain length of Cu interconnects
JournalApplied Physics Letters
AuthorsHau-Riege, C. S.Author
Thompson, C. V.Author
Year2000 (July 17)Volume77
Issue3
PublisherAIP Publishing
DOIdoi:10.1063/1.126973Search in ResearchGate
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Mindat Ref. ID8528062Long-form Identifiermindat:1:5:8528062:5
GUID0
Full ReferenceHau-Riege, C. S., Thompson, C. V. (2000) Use of scanned laser annealing to control the bamboo grain length of Cu interconnects. Applied Physics Letters, 77 (3). 352-354 doi:10.1063/1.126973
Plain TextHau-Riege, C. S., Thompson, C. V. (2000) Use of scanned laser annealing to control the bamboo grain length of Cu interconnects. Applied Physics Letters, 77 (3). 352-354 doi:10.1063/1.126973
In(2000, July) Applied Physics Letters Vol. 77 (3) AIP Publishing

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Hau-Riege, C. S., Thompson, C. V. (1999) Microstructural evolution induced by scanned laser annealing in Al interconnects. Applied Physics Letters, 75 (10). 1464-1466 doi:10.1063/1.124726
Hau-Riege, C. S., Thompson, C. V. (2001) Electromigration in Cu interconnects with very different grain structures. Applied Physics Letters, 78 (22). 3451-3453 doi:10.1063/1.1355304
Hau-Riege, C. S., Thompson, C. V. (2000) The effects of microstructural transitions at width transitions on interconnect reliability. Journal of Applied Physics, 87 (12). 8467-8472 doi:10.1063/1.373565
Hau-Riege, Stefan P., Thompson, Carl V. (2000) In situ transmission electron microscope studies of the kinetics of abnormal grain growth in electroplated copper films. Applied Physics Letters, 76 (3). 309-311 doi:10.1063/1.125729
Hau-Riege, Christine S., Hau-Riege, Stefan P., Marathe, Amit P. (2004) The effect of interlevel dielectric on the critical tensile stress to void nucleation for the reliability of Cu interconnects. Journal of Applied Physics, 96 (10). 5792-5796 doi:10.1063/1.1787139
Wei, Frank L., Hau-Riege, Christine S., Marathe, Amit P., Thompson, Carl V. (2008) Effects of active atomic sinks and reservoirs on the reliability of Cu∕low-k interconnects. Journal of Applied Physics, 103 (8). 84513pp. doi:10.1063/1.2907962
Hau-Riege, Stefan P. (2002) Probabilistic immortality of Cu damascene interconnects. Journal of Applied Physics, 91 (4). 2014-2022 doi:10.1063/1.1436562
Wei, Frank L., Gan, Chee Lip, Tan, Tam Lyn, Hau-Riege, Christine S., Marathe, Amit P., Vlassak, Joost J., Thompson, Carl V. (2008) Electromigration-induced extrusion failures in Cu/low-k interconnects. Journal of Applied Physics, 104 (2). 23529pp. doi:10.1063/1.2957057
Hau-Riege, Stefan P., Thompson, Carl V. (2000) Electromigration saturation in a simple interconnect tree. Journal of Applied Physics, 88 (5). 2382-2385 doi:10.1063/1.1288019
Joo, Young‐Chang, Thompson, Carl V. (1994) Analytic model for the grain structures of near‐bamboo interconnects. Journal of Applied Physics, 76 (11). 7339-7346 doi:10.1063/1.357979
Cho, J., Thompson, C. V. (1989) Grain size dependence of electromigration‐induced failures in narrow interconnects. Applied Physics Letters, 54 (25). 2577-2579 doi:10.1063/1.101054
 
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