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Brückner, W., Baunack, S., Hecker, M., Mönch, J.-I., van Loyen, L., Schneider, C. M. (2000) Interdiffusion in NiFe/Cu/NiFe trilayers: Possible failure mechanism for magnetoelectronic devices. Applied Physics Letters, 77 (3). 358-360 doi:10.1063/1.126975

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Reference TypeJournal (article/letter/editorial)
TitleInterdiffusion in NiFe/Cu/NiFe trilayers: Possible failure mechanism for magnetoelectronic devices
JournalApplied Physics Letters
AuthorsBrückner, W.Author
Baunack, S.Author
Hecker, M.Author
Mönch, J.-I.Author
van Loyen, L.Author
Schneider, C. M.Author
Year2000 (July 17)Volume77
Issue3
PublisherAIP Publishing
DOIdoi:10.1063/1.126975Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID8528064Long-form Identifiermindat:1:5:8528064:3
GUID0
Full ReferenceBrückner, W., Baunack, S., Hecker, M., Mönch, J.-I., van Loyen, L., Schneider, C. M. (2000) Interdiffusion in NiFe/Cu/NiFe trilayers: Possible failure mechanism for magnetoelectronic devices. Applied Physics Letters, 77 (3). 358-360 doi:10.1063/1.126975
Plain TextBrückner, W., Baunack, S., Hecker, M., Mönch, J.-I., van Loyen, L., Schneider, C. M. (2000) Interdiffusion in NiFe/Cu/NiFe trilayers: Possible failure mechanism for magnetoelectronic devices. Applied Physics Letters, 77 (3). 358-360 doi:10.1063/1.126975
In(2000, July) Applied Physics Letters Vol. 77 (3) AIP Publishing


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