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Hasegawa, Madoka, Yamachika, Noriyuki, Shacham-Diamand, Yosi, Okinaka, Yutaka, Osaka, Tetsuya (2007) Evidence for “superfilling” of submicrometer trenches with electroless copper deposit. Applied Physics Letters, 90 (10). 101916pp. doi:10.1063/1.2712505

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Reference TypeJournal (article/letter/editorial)
TitleEvidence for “superfilling” of submicrometer trenches with electroless copper deposit
JournalApplied Physics Letters
AuthorsHasegawa, MadokaAuthor
Yamachika, NoriyukiAuthor
Shacham-Diamand, YosiAuthor
Okinaka, YutakaAuthor
Osaka, TetsuyaAuthor
Year2007 (March 5)Volume90
Issue10
PublisherAIP Publishing
DOIdoi:10.1063/1.2712505Search in ResearchGate
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Mindat Ref. ID8552801Long-form Identifiermindat:1:5:8552801:1
GUID0
Full ReferenceHasegawa, Madoka, Yamachika, Noriyuki, Shacham-Diamand, Yosi, Okinaka, Yutaka, Osaka, Tetsuya (2007) Evidence for “superfilling” of submicrometer trenches with electroless copper deposit. Applied Physics Letters, 90 (10). 101916pp. doi:10.1063/1.2712505
Plain TextHasegawa, Madoka, Yamachika, Noriyuki, Shacham-Diamand, Yosi, Okinaka, Yutaka, Osaka, Tetsuya (2007) Evidence for “superfilling” of submicrometer trenches with electroless copper deposit. Applied Physics Letters, 90 (10). 101916pp. doi:10.1063/1.2712505
In(2007, March) Applied Physics Letters Vol. 90 (10) AIP Publishing

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HASEGAWA, Madoka, YAMACHIKA, Noriyuki, OKINAKA, Yutaka, SHACHAM-DIAMAND, Yosi, OSAKA, Tetsuya (2007) An Electrochemical Investigation of Additive Effect in Trench-Filling of ULSI Interconnects by Electroless Copper Deposition. Electrochemistry, 75 (4) 349-358 doi:10.5796/electrochemistry.75.349
Hasegawa, Madoka, Negishi, Yoshinori, Nakanishi, Takuya, Osaka, Tetsuya (2005) Effects of Additives on Copper Electrodeposition in Submicrometer Trenches. Journal of the Electrochemical Society, 152. doi:10.1149/1.1867672
OSAKA, Tetsuya, WAKATSUKI, Satoshi, MASUDA, Toyoto, YOSHINO, Masahiro, YAMACHIKA, Noriyuki, SASANO, Junji, MATSUDA, Itsuaki, OKINAKA, Yutaka (2008) A Wet Process for Forming an Adhesive Copper Layer on Polyimide Film. Electrochemistry, 76 (3) 191-196 doi:10.5796/electrochemistry.76.191
Hasegawa, Madoka, Nonaka, Yuichi, Negishi, Yoshinori, Okinaka, Yutaka, Osaka, Tetsuya (2006) Enhancement of the Ductility of Electrodeposited Copper Films by Room-Temperature Recrystallization. Journal of the Electrochemical Society, 153. doi:10.1149/1.2149299
Osaka, Tetsuya, Aramaki, Hitoshi, Yoshino, Masahiro, Ueno, Kazuyoshi, Matsuda, Itsuaki, Shacham-Diamand, Yosi (2009) Fabrication of Electroless CoWP/NiB Diffusion Barrier Layer on SiO[sub 2] for ULSI Devices. Journal of the Electrochemical Society, 156. doi:10.1149/1.3158561
Yamachika, Noriyuki, Musha, Yuta, Sasano, Junji, Senda, Kazutaka, Kato, Masaru, Okinaka, Yutaka, Osaka, Tetsuya (2008) Electrodeposition of amorphous Au–Ni alloy film. Electrochimica Acta, 53 (13). 4520-4527 doi:10.1016/j.electacta.2008.01.018
Einati, Hila, Novitski, Roman, Shacham-Diamand, Yosi (2010) Nonlinear pH sensitivity of molecular modified transistors. Applied Physics Letters, 97 (1). 13505pp. doi:10.1063/1.3462318
Shacham-Diamand, Yosi, Lopatin, Sergey (1999) Integrated electroless metallization for ULSI. Electrochimica Acta, 44 (21). 3639-3649 doi:10.1016/s0013-4686(99)00067-5
Osaka, Tetsuya, Matsunaga, Mariko, Kudo, So, Niwa, Daisuke, Shacham-Diamand, Yosi, Jaegermann, Wolfram, Hunger, Ralf (2007) Electrical and Electrochemical Properties of Alkyl-Monolayer Modified Si(111) in the Presence of Water. Journal of the Electrochemical Society, 154. doi:10.1149/1.2775162
Hideshima, Sho, Einati, Hila, Nakamura, Takahiro, Kuroiwa, Shigeki, Shacham-Diamand, Yosi, Osaka, Tetsuya (2010) Theoretical Optimization Method of Buffer Ionic Concentration for Protein Detection Using Field Effect Transistors. Journal of the Electrochemical Society, 157. doi:10.1149/1.3491764
Inberg, Alexandra, Bogush, Vadim, Croitoru, Nathan, Shacham-Diamand, Yosi (2007) Electrochemical Study of the Mechanism of Ag(W) Electroless Deposition. Journal of the Electrochemical Society, 154. doi:10.1149/1.2372696
 
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