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Chen, Kuan-Chia, Liao, Chien-Neng, Wu, Wen-Wei, Chen, Lih-Juann (2007) Direct observation of electromigration-induced surface atomic steps in Cu lines by in situ transmission electron microscopy. Applied Physics Letters, 90 (20). 203101pp. doi:10.1063/1.2740109

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Reference TypeJournal (article/letter/editorial)
TitleDirect observation of electromigration-induced surface atomic steps in Cu lines by in situ transmission electron microscopy
JournalApplied Physics Letters
AuthorsChen, Kuan-ChiaAuthor
Liao, Chien-NengAuthor
Wu, Wen-WeiAuthor
Chen, Lih-JuannAuthor
Year2007 (May 14)Volume90
Issue20
PublisherAIP Publishing
DOIdoi:10.1063/1.2740109Search in ResearchGate
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Mindat Ref. ID8554163Long-form Identifiermindat:1:5:8554163:2
GUID0
Full ReferenceChen, Kuan-Chia, Liao, Chien-Neng, Wu, Wen-Wei, Chen, Lih-Juann (2007) Direct observation of electromigration-induced surface atomic steps in Cu lines by in situ transmission electron microscopy. Applied Physics Letters, 90 (20). 203101pp. doi:10.1063/1.2740109
Plain TextChen, Kuan-Chia, Liao, Chien-Neng, Wu, Wen-Wei, Chen, Lih-Juann (2007) Direct observation of electromigration-induced surface atomic steps in Cu lines by in situ transmission electron microscopy. Applied Physics Letters, 90 (20). 203101pp. doi:10.1063/1.2740109
In(2007, May) Applied Physics Letters Vol. 90 (20) AIP Publishing

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Chen, Kuan-Chia, Wu, Wen-Wei, Liao, Chien-Neng, Chen, Lih-Juann, Tu, K. N. (2010) Stability of nanoscale twins in copper under electric current stressing. Journal of Applied Physics, 108 (6). 66103pp. doi:10.1063/1.3483949
Chen, Hsin-Ping, Huang, Chun-Wei, Wang, Chun-Wen, Wu, Wen-Wei, Liao, Chien-Neng, Chen, Lih-Juann, Tu, King-Ning (2016) Optimization of the nanotwin-induced zigzag surface of copper by electromigration. Nanoscale, 8. 2584-2588 doi:10.1039/c5nr05418d
Chan, Tsung-Cheng, Chen, Kuan-Chia, Liao, Chien-Neng (2011) Surface roughness reduction in nanocrystalline Cu thin films by electrical stressing treatment. Applied Physics Letters, 98 (18). 181902pp. doi:10.1063/1.3586772
Liao, C. N., Chen, K. C., Wu, W. W., Chen, L. J. (2005) In situ transmission electron microscope observations of electromigration in copper lines at room temperature. Applied Physics Letters, 87 (14). 141903pp. doi:10.1063/1.2081138
Hsin, Cheng-Lun, Huang, Chun-Wei, Chen, Jui-Yuan, Liao, Kuo-Cheng, Liu, Po-Liang, Wu, Wen-Wei, Chen, Lih-Juann (2015) Direct Observation of Sublimation Behaviors in One-Dimensional In2Se3/In2O3 Nanoheterostructures. Analytical Chemistry, 87 (11). 5584-5588 doi:10.1021/acs.analchem.5b00255
Engler, Brent, Hull, Robert (2023) High temperature electromigration behavior of cobalt lines observed by in situ transmission electron microscopy. Applied Physics Letters, 123 (8) doi:10.1063/5.0160825
Liao, Chien-Neng, Chung, Chien-Ping, Chen, Wen-Tai (2005) Electromigration-induced Pb segregation in eutectic Sn–Pb molten solder. Journal of Materials Research, 20 (12) 3425-3430 doi:10.1557/jmr.2005.0420
Lee, Chung-Yang, Lu, Ming-Pei, Liao, Kao-Feng, Wu, Wen-Wei, Chen, Lih-Juann (2008) Vertically well-aligned epitaxial Ni31Si12 nanowire arrays with excellent field emission properties. Applied Physics Letters, 93 (11). 113109pp. doi:10.1063/1.2981703
Tsai, Chih-Hao, Pan, Fu-Ming, Chen, Kuan-Jung, Wei, Cheng-Yang, Liu, Mei, Mo, Chi-Neng (2007) Nanogap formation by palladium hydrogenation for surface conduction electron emitters fabrication. Applied Physics Letters, 90 (16). 163115pp. doi:10.1063/1.2728761
Chen, Lih-Juann, Wu, Wen-Wei (2015) Metal silicide nanowires. Japanese Journal of Applied Physics, 54 (7) 7 doi:10.7567/jjap.54.07ja04
Heersche, Hubert B., Lientschnig, Günther, O’Neill, Kevin, van der Zant, Herre S. J., Zandbergen, Henny W. (2007) In situ imaging of electromigration-induced nanogap formation by transmission electron microscopy. Applied Physics Letters, 91 (7). 72107pp. doi:10.1063/1.2767149
 
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