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Vijayashankar, Dandapani, Zhu, Hong, Garg, Saurabh, Teki, Ranganath, Ramprasad, R., Lane, Michael W., Ramanath, Ganpati (2011) Atomistic mechanisms of moisture-induced fracture at copper-silica interfaces. Applied Physics Letters, 99 (13). 133103pp. doi:10.1063/1.3622304

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Reference TypeJournal (article/letter/editorial)
TitleAtomistic mechanisms of moisture-induced fracture at copper-silica interfaces
JournalApplied Physics Letters
AuthorsVijayashankar, DandapaniAuthor
Zhu, HongAuthor
Garg, SaurabhAuthor
Teki, RanganathAuthor
Ramprasad, R.Author
Lane, Michael W.Author
Ramanath, GanpatiAuthor
Year2011 (September 26)Volume99
Issue13
PublisherAIP Publishing
DOIdoi:10.1063/1.3622304Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID8596105Long-form Identifiermindat:1:5:8596105:8
GUID0
Full ReferenceVijayashankar, Dandapani, Zhu, Hong, Garg, Saurabh, Teki, Ranganath, Ramprasad, R., Lane, Michael W., Ramanath, Ganpati (2011) Atomistic mechanisms of moisture-induced fracture at copper-silica interfaces. Applied Physics Letters, 99 (13). 133103pp. doi:10.1063/1.3622304
Plain TextVijayashankar, Dandapani, Zhu, Hong, Garg, Saurabh, Teki, Ranganath, Ramprasad, R., Lane, Michael W., Ramanath, Ganpati (2011) Atomistic mechanisms of moisture-induced fracture at copper-silica interfaces. Applied Physics Letters, 99 (13). 133103pp. doi:10.1063/1.3622304
In(2011, September) Applied Physics Letters Vol. 99 (13) AIP Publishing

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