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Zhu, Wenhui, Yang, Hanjie, Chen, Zhuo (2018) Superior electromigration resistance of a microsized solder interconnection containing a single-Sn grain. Applied Physics Letters, 113 (10). 103502pp. doi:10.1063/1.5044554

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Reference TypeJournal (article/letter/editorial)
TitleSuperior electromigration resistance of a microsized solder interconnection containing a single-Sn grain
JournalApplied Physics Letters
AuthorsZhu, WenhuiAuthor
Yang, HanjieAuthor
Chen, ZhuoAuthor
Year2018 (September 3)Volume113
Issue10
PublisherAIP Publishing
DOIdoi:10.1063/1.5044554Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID8653616Long-form Identifiermindat:1:5:8653616:9
GUID0
Full ReferenceZhu, Wenhui, Yang, Hanjie, Chen, Zhuo (2018) Superior electromigration resistance of a microsized solder interconnection containing a single-Sn grain. Applied Physics Letters, 113 (10). 103502pp. doi:10.1063/1.5044554
Plain TextZhu, Wenhui, Yang, Hanjie, Chen, Zhuo (2018) Superior electromigration resistance of a microsized solder interconnection containing a single-Sn grain. Applied Physics Letters, 113 (10). 103502pp. doi:10.1063/1.5044554
In(2018, September) Applied Physics Letters Vol. 113 (10) AIP Publishing

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Chen, Jian-Qiang, Guo, Jing-Dong, Liu, Kai-Lang, Shang, Jian-Ku (2013) Dependence of electromigration damage on Sn grain orientation in Sn–Ag–Cu solder joints. Journal of Applied Physics, 114 (15). 153509pp. doi:10.1063/1.4825323
Liu, C. Y., Chen, Chih, Tu, K. N. (2000) Electromigration in Sn–Pb solder strips as a function of alloy composition. Journal of Applied Physics, 88 (10). 5703-5709 doi:10.1063/1.1319327
Shingubara, Shoso, Nakasaki, Yasushi, Kaneko, Hisashi (1991) Electromigration in a single crystalline submicron width aluminum interconnection. Applied Physics Letters, 58 (1). 42-44 doi:10.1063/1.104431
Shen, Hao, Zhu, Wenxin, Li, Yao, Tamura, Nobumichi, Chen, Kai (2016) In situ synchrotron study of electromigration induced grain rotations in Sn solder joints. Scientific Reports, 6. doi:10.1038/srep24418
Lloyd, J. R. (2003) Electromigration induced resistance decrease in Sn conductors. Journal of Applied Physics, 94 (10). 6483-6486 doi:10.1063/1.1623632
Zhang, Jun, Yang, Yang, Zhu, Benpeng, Li, Xiangjia, Jin, Jie, Chen, Zeyu, Chen, Yong, Zhou, Qifa (2018) Multifocal point beam forming by a single ultrasonic transducer with 3D printed holograms. Applied Physics Letters, 113 (24). 243502pp. doi:10.1063/1.5058079
Wei, C. C., Chen, Chih (2006) Critical length of electromigration for eutectic SnPb solder stripe. Applied Physics Letters, 88 (18). 182105pp. doi:10.1063/1.2200158
Chang, Y. W., Chiang, T. H., Chen, Chih (2007) Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure. Applied Physics Letters, 91 (13). 132113pp. doi:10.1063/1.2790376
Ma, Limin, Zuo, Yong, Liu, Sihan, Guo, Fu, Wang, Xitao (2013) The failure models of Sn-based solder joints under coupling effects of electromigration and thermal cycling. Journal of Applied Physics, 113 (4). 44904pp. doi:10.1063/1.4789023
Jung, Yong, Yu, Jin (2014) Electromigration induced Kirkendall void growth in Sn-3.5Ag/Cu solder joints. Journal of Applied Physics, 115 (8). 83708pp. doi:10.1063/1.4867115
Wang, Yiwei, Ho, Paul S. (2013) Mode II electromigration failure mechanism in Sn-based Pb-free solder joints with Ni under-bump metallization. Applied Physics Letters, 103 (12). 121909pp. doi:10.1063/1.4821819
 
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