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Yong, Tang, Bo, Wang, Pang, Qiu (2019) Thermal Breakdown Failure Mechanisms of IGBT Chips. IOP Conference Series: Earth and Environmental Science, 223. 12024pp. doi:10.1088/1755-1315/223/1/012024

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Reference TypeJournal (article/letter/editorial)
TitleThermal Breakdown Failure Mechanisms of IGBT Chips
JournalIOP Conference Series: Earth and Environmental Science
AuthorsYong, TangAuthor
Bo, WangAuthor
Pang, QiuAuthor
Year2019 (January 21)Volume223
PublisherIOP Publishing
DOIdoi:10.1088/1755-1315/223/1/012024Search in ResearchGate
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Mindat Ref. ID9577060Long-form Identifiermindat:1:5:9577060:4
GUID0
Full ReferenceYong, Tang, Bo, Wang, Pang, Qiu (2019) Thermal Breakdown Failure Mechanisms of IGBT Chips. IOP Conference Series: Earth and Environmental Science, 223. 12024pp. doi:10.1088/1755-1315/223/1/012024
Plain TextYong, Tang, Bo, Wang, Pang, Qiu (2019) Thermal Breakdown Failure Mechanisms of IGBT Chips. IOP Conference Series: Earth and Environmental Science, 223. 12024pp. doi:10.1088/1755-1315/223/1/012024
In(2019) IOP Conference Series: Earth and Environmental Science Vol. 223. IOP Publishing

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