Reference Type | Journal (article/letter/editorial) |
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Title | The influence of Cu, Mg and Ni on the solidification and microstructure of Al-Si alloys |
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Journal | IOP Conference Series: Materials Science and Engineering |
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Authors | Darlapudi, A | Author |
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McDonald, S D | Author |
StJohn, D H | Author |
Year | 2016 (March) | Volume | 117 |
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Publisher | IOP Publishing |
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DOI | doi:10.1088/1757-899x/117/1/012022Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 9780913 | Long-form Identifier | mindat:1:5:9780913:1 |
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GUID | 0 |
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Full Reference | Darlapudi, A, McDonald, S D, StJohn, D H (2016) The influence of Cu, Mg and Ni on the solidification and microstructure of Al-Si alloys. IOP Conference Series: Materials Science and Engineering, 117. 12022pp. doi:10.1088/1757-899x/117/1/012022 |
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Plain Text | Darlapudi, A, McDonald, S D, StJohn, D H (2016) The influence of Cu, Mg and Ni on the solidification and microstructure of Al-Si alloys. IOP Conference Series: Materials Science and Engineering, 117. 12022pp. doi:10.1088/1757-899x/117/1/012022 |
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In | (n.d.) IOP Conference Series: Materials Science and Engineering Vol. 117. IOP Publishing |
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