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Liu, W F, Yang, Y Y, Wang, C N (2017) Analysis of flow field characteristics in IC equipment chamber based on orthogonal design. IOP Conference Series: Materials Science and Engineering, 167. 12031pp. doi:10.1088/1757-899x/167/1/012031

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Reference TypeJournal (article/letter/editorial)
TitleAnalysis of flow field characteristics in IC equipment chamber based on orthogonal design
JournalIOP Conference Series: Materials Science and Engineering
AuthorsLiu, W FAuthor
Yang, Y YAuthor
Wang, C NAuthor
Year2017 (January)Volume167
PublisherIOP Publishing
DOIdoi:10.1088/1757-899x/167/1/012031Search in ResearchGate
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Mindat Ref. ID9784098Long-form Identifiermindat:1:5:9784098:9
GUID0
Full ReferenceLiu, W F, Yang, Y Y, Wang, C N (2017) Analysis of flow field characteristics in IC equipment chamber based on orthogonal design. IOP Conference Series: Materials Science and Engineering, 167. 12031pp. doi:10.1088/1757-899x/167/1/012031
Plain TextLiu, W F, Yang, Y Y, Wang, C N (2017) Analysis of flow field characteristics in IC equipment chamber based on orthogonal design. IOP Conference Series: Materials Science and Engineering, 167. 12031pp. doi:10.1088/1757-899x/167/1/012031
In(n.d.) IOP Conference Series: Materials Science and Engineering Vol. 167. IOP Publishing

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