Reference Type | Journal (article/letter/editorial) |
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Title | Effect of Different Amount of Silicon Carbide on SAC Solder-Cu Joint Performance by Using Microwave Hybrid Heating Method |
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Journal | IOP Conference Series: Materials Science and Engineering |
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Authors | Maliessa, N M | Author |
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Idris, S R A | Author |
Year | 2019 (January 16) | Volume | 469 |
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Publisher | IOP Publishing |
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DOI | doi:10.1088/1757-899x/469/1/012110Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 9809191 | Long-form Identifier | mindat:1:5:9809191:5 |
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GUID | 0 |
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Full Reference | Maliessa, N M, Idris, S R A (2019) Effect of Different Amount of Silicon Carbide on SAC Solder-Cu Joint Performance by Using Microwave Hybrid Heating Method. IOP Conference Series: Materials Science and Engineering, 469. 12110pp. doi:10.1088/1757-899x/469/1/012110 |
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Plain Text | Maliessa, N M, Idris, S R A (2019) Effect of Different Amount of Silicon Carbide on SAC Solder-Cu Joint Performance by Using Microwave Hybrid Heating Method. IOP Conference Series: Materials Science and Engineering, 469. 12110pp. doi:10.1088/1757-899x/469/1/012110 |
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In | (n.d.) IOP Conference Series: Materials Science and Engineering Vol. 469. IOP Publishing |
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