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Wang, Yongguang, Zhao, Yongwu (2007) Modeling the effects of oxidizer, complexing agent and inhibitor on material removal for copper chemical mechanical polishing. Applied Surface Science, 254. 1517-1523 doi:10.1016/j.apsusc.2007.07.005

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Reference TypeJournal (article/letter/editorial)
TitleModeling the effects of oxidizer, complexing agent and inhibitor on material removal for copper chemical mechanical polishing
JournalApplied Surface Science
AuthorsWang, YongguangAuthor
Zhao, YongwuAuthor
Year2007 (December)Volume254
PublisherElsevier BV
DOIdoi:10.1016/j.apsusc.2007.07.005Search in ResearchGate
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Mindat Ref. ID9912063Long-form Identifiermindat:1:5:9912063:0
GUID0
Full ReferenceWang, Yongguang, Zhao, Yongwu (2007) Modeling the effects of oxidizer, complexing agent and inhibitor on material removal for copper chemical mechanical polishing. Applied Surface Science, 254. 1517-1523 doi:10.1016/j.apsusc.2007.07.005
Plain TextWang, Yongguang, Zhao, Yongwu (2007) Modeling the effects of oxidizer, complexing agent and inhibitor on material removal for copper chemical mechanical polishing. Applied Surface Science, 254. 1517-1523 doi:10.1016/j.apsusc.2007.07.005
In(n.d.) Applied Surface Science Vol. 254. Elsevier BV

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