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Tsai, Du-Cheng, Huang, Yen-Lin, Lin, Sheng-Ru, Jung, De-Ru, Chang, Shou-Yi, Shieu, Fuh-Sheng (2011) Diffusion barrier performance of TiVCr alloy film in Cu metallization. Applied Surface Science, 257. 4923-4927 doi:10.1016/j.apsusc.2010.12.149

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Reference TypeJournal (article/letter/editorial)
TitleDiffusion barrier performance of TiVCr alloy film in Cu metallization
JournalApplied Surface Science
AuthorsTsai, Du-ChengAuthor
Huang, Yen-LinAuthor
Lin, Sheng-RuAuthor
Jung, De-RuAuthor
Chang, Shou-YiAuthor
Shieu, Fuh-ShengAuthor
Year2011 (March)Volume257
PublisherElsevier BV
DOIdoi:10.1016/j.apsusc.2010.12.149Search in ResearchGate
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Mindat Ref. ID9915743Long-form Identifiermindat:1:5:9915743:0
GUID0
Full ReferenceTsai, Du-Cheng, Huang, Yen-Lin, Lin, Sheng-Ru, Jung, De-Ru, Chang, Shou-Yi, Shieu, Fuh-Sheng (2011) Diffusion barrier performance of TiVCr alloy film in Cu metallization. Applied Surface Science, 257. 4923-4927 doi:10.1016/j.apsusc.2010.12.149
Plain TextTsai, Du-Cheng, Huang, Yen-Lin, Lin, Sheng-Ru, Jung, De-Ru, Chang, Shou-Yi, Shieu, Fuh-Sheng (2011) Diffusion barrier performance of TiVCr alloy film in Cu metallization. Applied Surface Science, 257. 4923-4927 doi:10.1016/j.apsusc.2010.12.149
In(n.d.) Applied Surface Science Vol. 257. Elsevier BV

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