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Wen, S.F., Yan, W.Z., Kang, J.X., Liu, J., Yue, Z.F. (2010) Simulation of the interface characterization of thin film on substrate system by bending creep tests. Applied Surface Science, 257. 1289-1294 doi:10.1016/j.apsusc.2010.08.049

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Reference TypeJournal (article/letter/editorial)
TitleSimulation of the interface characterization of thin film on substrate system by bending creep tests
JournalApplied Surface Science
AuthorsWen, S.F.Author
Yan, W.Z.Author
Kang, J.X.Author
Liu, J.Author
Yue, Z.F.Author
Year2010 (December)Volume257
PublisherElsevier BV
DOIdoi:10.1016/j.apsusc.2010.08.049Search in ResearchGate
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Mindat Ref. ID9916897Long-form Identifiermindat:1:5:9916897:7
GUID0
Full ReferenceWen, S.F., Yan, W.Z., Kang, J.X., Liu, J., Yue, Z.F. (2010) Simulation of the interface characterization of thin film on substrate system by bending creep tests. Applied Surface Science, 257. 1289-1294 doi:10.1016/j.apsusc.2010.08.049
Plain TextWen, S.F., Yan, W.Z., Kang, J.X., Liu, J., Yue, Z.F. (2010) Simulation of the interface characterization of thin film on substrate system by bending creep tests. Applied Surface Science, 257. 1289-1294 doi:10.1016/j.apsusc.2010.08.049
In(n.d.) Applied Surface Science Vol. 257. Elsevier BV

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