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Lin, Shiang-Jiun, Wu, Cheng-Da, Fang, Te-Hua, Chen, Guan-Hung (2012) Effects of incident cluster size, substrate temperature, and incident energy on bombardment of Ni clusters onto Cu (001) surface studied using molecular dynamics simulation. Applied Surface Science, 258. 5892-5897 doi:10.1016/j.apsusc.2012.02.133

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Reference TypeJournal (article/letter/editorial)
TitleEffects of incident cluster size, substrate temperature, and incident energy on bombardment of Ni clusters onto Cu (001) surface studied using molecular dynamics simulation
JournalApplied Surface Science
AuthorsLin, Shiang-JiunAuthor
Wu, Cheng-DaAuthor
Fang, Te-HuaAuthor
Chen, Guan-HungAuthor
Year2012 (May)Volume258
PublisherElsevier BV
DOIdoi:10.1016/j.apsusc.2012.02.133Search in ResearchGate
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Mindat Ref. ID9917819Long-form Identifiermindat:1:5:9917819:6
GUID0
Full ReferenceLin, Shiang-Jiun, Wu, Cheng-Da, Fang, Te-Hua, Chen, Guan-Hung (2012) Effects of incident cluster size, substrate temperature, and incident energy on bombardment of Ni clusters onto Cu (001) surface studied using molecular dynamics simulation. Applied Surface Science, 258. 5892-5897 doi:10.1016/j.apsusc.2012.02.133
Plain TextLin, Shiang-Jiun, Wu, Cheng-Da, Fang, Te-Hua, Chen, Guan-Hung (2012) Effects of incident cluster size, substrate temperature, and incident energy on bombardment of Ni clusters onto Cu (001) surface studied using molecular dynamics simulation. Applied Surface Science, 258. 5892-5897 doi:10.1016/j.apsusc.2012.02.133
In(n.d.) Applied Surface Science Vol. 258. Elsevier BV

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Lin, Shiang-Jiun, Wu, Cheng-Da, Fang, Te-Hua, Kuo, Li-Min (2011) Effects of Surface Roughness on Nanojet Ejection Process Using Molecular Dynamics Simulation. Journal of Computational and Theoretical Nanoscience, 8 (9). 1686-1693 doi:10.1166/jctn.2011.1947
Fang, Te-Hua, Wu, Cheng-Da, Chang, Win-Jin, Chi, Sung-Shui (2009) Effect of thermal annealing on nanoimprinted Cu–Ni alloys using molecular dynamics simulation. Applied Surface Science, 255. 6043-6047 doi:10.1016/j.apsusc.2009.01.069
Fang, Te-Hua, Wu, Cheng-Da, Chang, Win-Jin (2007) Molecular dynamics analysis of nanoimprinted Cu–Ni alloys. Applied Surface Science, 253. 6963-6968 doi:10.1016/j.apsusc.2007.02.017
Sung, Po-Hsien, Wu, Cheng-Da, Fang, Te-Hua, Weng, Cheng-I (2012) Size effect on shape recovery and induced strain of NiTi nanowires. Applied Surface Science, 258. 7064-7069 doi:10.1016/j.apsusc.2012.03.178
Wu, Cheng-Da, Fang, Te-Hua, Lin, Jen-Fin (2014) Effects of mold geometry and taper angles on the filling mechanism of a nanoimprinted polymer using molecular dynamics. Applied Surface Science, 316. 292-300 doi:10.1016/j.apsusc.2014.08.015
Wu, Cheng-Da, Fang, Te-Hua, Lin, Jen-Fin (2012) Effects of tip-substrate gap, deposition temperature, holding time, and pull-off velocity on dip-pen lithography investigated using molecular dynamics simulation. Journal of Applied Physics, 111 (10). 103521pp. doi:10.1063/1.4720576
Hong, Zheng Han, Hwang, Shun Fa, Fang, Te Hua (2008) Effect of Substrate Temperature and Incident Energy for Alloyzation of Co onto Cu(001) Substrate. Advanced Materials Research, 47. 375-378 doi:10.4028/www.scientific.net/amr.47-50.375
Wu, Cheng-Da, Fang, Te-Hua, Huang, Yan-Jiun (2011) Effects of non-flat contact and interference on self-assembled monolayers under sliding friction. Applied Surface Science, 257. 4123-4128 doi:10.1016/j.apsusc.2010.11.186
 
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