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Yoon, Jeong-Won, Bae, Soyoung, Lee, Byung-Suk, Jung, Seung-Boo (2020) Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications. Applied Surface Science, 515. 146060pp. doi:10.1016/j.apsusc.2020.146060

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Reference TypeJournal (article/letter/editorial)
TitleBonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications
JournalApplied Surface Science
AuthorsYoon, Jeong-WonAuthor
Bae, SoyoungAuthor
Lee, Byung-SukAuthor
Jung, Seung-BooAuthor
Year2020 (June)Volume515
PublisherElsevier BV
DOIdoi:10.1016/j.apsusc.2020.146060Search in ResearchGate
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Mindat Ref. ID9941641Long-form Identifiermindat:1:5:9941641:2
GUID0
Full ReferenceYoon, Jeong-Won, Bae, Soyoung, Lee, Byung-Suk, Jung, Seung-Boo (2020) Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications. Applied Surface Science, 515. 146060pp. doi:10.1016/j.apsusc.2020.146060
Plain TextYoon, Jeong-Won, Bae, Soyoung, Lee, Byung-Suk, Jung, Seung-Boo (2020) Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications. Applied Surface Science, 515. 146060pp. doi:10.1016/j.apsusc.2020.146060
In(n.d.) Applied Surface Science Vol. 515. Elsevier BV

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Jeong, So-Eun, Jung, Seung-Boo, Yoon, Jeong-Won (2022) High-temperature stability of Ni-Sn intermetallic joints for power device packaging. Journal of Alloys and Compounds, 890. 161778pp. doi:10.1016/j.jallcom.2021.161778
Yoon, Jeong-Won, Lee, Chang-Bae, Jung, Seung-Boo (2002) Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate. MATERIALS TRANSACTIONS, 43 (8). 1821-1826 doi:10.2320/matertrans.43.1821
Yoon, Jeong-Won, Lee, Chang-Yong, Lee, Chang-Bae, Yoo, Choong-Sik, Jung, Seung-Boo (2003) Investigation of Interfacial Reactions between Sn–Ag–Bi–In Solder and (Cu, Electroless Ni–P/Cu) Substrate. Zeitschrift für Metallkunde, 94. 453-457 doi:10.3139/146.030453
Lee, Byung-Suk, Lee, Chang-Woo, Yoon, Jeong-Won (2016) Comparative study of Au-Sn and Sn-Ag-Cu as die-attach materials for power electronics applications. Surface and Interface Analysis, 48 (7). 493-497 doi:10.1002/sia.5998
Yoon, Jeong Won, Lee, Chang Bae, Jung, Seung Boo (2004) Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging. Materials Science Forum, 449. 893-896 doi:10.4028/www.scientific.net/msf.449-452.893
Yoon, Jeong-Won, Lee, Young-Ho, Kim, Dae-Gon, Kang, Han-Byul, Suh, Su-Jeong, Yang, Cheol-Woong, Lee, Chang-Bae, Jung, Jong-Man, Yoo, Choong-Sik, Jung, Seung-Boo (2004) Intermetallic compound layer growth at the interface between Sn–Cu–Ni solder and Cu substrate. Journal of Alloys and Compounds, 381. 151-157 doi:10.1016/j.jallcom.2004.03.076
Chun, Hyun-Suk, Yoon, Jeong-Won, Jung, Seung-Boo (2007) Solid-state interfacial reactions between Sn–3.5Ag–0.7Cu solder and electroless Ni-immersion Au substrate during high temperature storage test. Journal of Alloys and Compounds, 439. 91-96 doi:10.1016/j.jallcom.2006.08.240
Yoon, Jeong-Won, Noh, Bo-In, Jung, Seung-Boo (2014) Effect of rare earth metal Ce addition to Sn-Ag solder on interfacial reactions with Cu substrate. Metals and Materials International, 20. 515-519 doi:10.1007/s12540-014-3016-3
Kim, Jungsoo, Jung, Seung-Boo, Yoon, Jeong-Won (2020) Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0Ag-0.5Cu/thin-Au/Pd/Ni(P) solder joints. Applied Surface Science, 503. 144339pp. doi:10.1016/j.apsusc.2019.144339
Yoon, Jeong-Won, Chun, Hyun-Suk, Jung, Seung-Boo (2008) Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints. Materials Science and Engineering: A, 483. 731-734 doi:10.1016/j.msea.2006.09.162
Yoon, Jeong-Won, Jung, Seung-Boo (2003) Investigation of interfacial reactions between Sn–5Bi solder and Cu substrate. Journal of Alloys and Compounds, 359. 202-208 doi:10.1016/s0925-8388(03)00291-3
 
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