Vote for your favorite mineral in #MinCup25! - Cuprosklodowskite vs. Ikaite
It's radioactive #cuprosklodowskite vs ephemeral #ikaite for today's match.
Log InRegister
Quick Links : The Mindat ManualThe Rock H. Currier Digital LibraryMindat Newsletter [Free Download]
Home PageAbout MindatThe Mindat ManualHistory of MindatCopyright StatusWho We AreContact UsAdvertise on Mindat
Donate to MindatCorporate SponsorshipSponsor a PageSponsored PagesMindat AdvertisersAdvertise on Mindat
Learning CenterWhat is a mineral?The most common minerals on earthInformation for EducatorsMindat ArticlesThe ElementsThe Rock H. Currier Digital LibraryGeologic Time
Minerals by PropertiesMinerals by ChemistryAdvanced Locality SearchRandom MineralRandom LocalitySearch by minIDLocalities Near MeSearch ArticlesSearch GlossaryMore Search Options
Search For:
Mineral Name:
Locality Name:
Keyword(s):
 
The Mindat ManualAdd a New PhotoRate PhotosLocality Edit ReportCoordinate Completion ReportAdd Glossary Item
Mining CompaniesStatisticsUsersMineral MuseumsClubs & OrganizationsMineral Shows & EventsThe Mindat DirectoryDevice SettingsThe Mineral Quiz
Photo SearchPhoto GalleriesSearch by ColorNew Photos TodayNew Photos YesterdayMembers' Photo GalleriesPast Photo of the Day GalleryPhotography

El-Daly, A.A., Hammad, A.E. (2010) Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn–9Zn lead-free solders. Materials Science and Engineering: A, 527. 5212-5219 doi:10.1016/j.msea.2010.04.078

Advanced
   -   Only viewable:
Reference TypeJournal (article/letter/editorial)
TitleEffects of small addition of Ag and/or Cu on the microstructure and properties of Sn–9Zn lead-free solders
JournalMaterials Science and Engineering: A
AuthorsEl-Daly, A.A.Author
Hammad, A.E.Author
Year2010 (July)Volume527
PublisherElsevier BV
DOIdoi:10.1016/j.msea.2010.04.078Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID10040212Long-form Identifiermindat:1:5:10040212:8
GUID0
Full ReferenceEl-Daly, A.A., Hammad, A.E. (2010) Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn–9Zn lead-free solders. Materials Science and Engineering: A, 527. 5212-5219 doi:10.1016/j.msea.2010.04.078
Plain TextEl-Daly, A.A., Hammad, A.E. (2010) Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn–9Zn lead-free solders. Materials Science and Engineering: A, 527. 5212-5219 doi:10.1016/j.msea.2010.04.078
In(n.d.) Materials Science and Engineering: A Vol. 527. Elsevier BV

See Also

These are possibly similar items as determined by title/reference text matching only.

El-Daly, A.A., Hammad, A.E., Al-Ganainy, G.S., Ragab, M. (2014) Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders. Materials Science and Engineering: A, 608. 130-138 doi:10.1016/j.msea.2014.04.070
El-Daly, A.A., Hammad, A.E., Al-Ganainy, G.S., Ragab, M. (2014) Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn. Journal of Alloys and Compounds, 614. 20-28 doi:10.1016/j.jallcom.2014.06.009
El-Daly, A.A., Hammad, A.E. (2011) Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In. Journal of Alloys and Compounds, 509. 8554-8560 doi:10.1016/j.jallcom.2011.05.119
El-Daly, A.A., El-Tantawy, Farid, Hammad, A.E., Gaafar, M.S., El-Mossalamy, E.H., Al-Ghamdi, A.A. (2011) Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In. Journal of Alloys and Compounds, 509. 7238-7246 doi:10.1016/j.jallcom.2011.01.062
El-Daly, A.A., Mohamad, A.Z., Fawzy, A., El-Taher, A.M. (2011) Creep behavior of near-peritectic Sn–5Sb solders containing small amount of Ag and Cu. Materials Science and Engineering: A, 528. 1055-1062 doi:10.1016/j.msea.2010.11.001
El-Daly, A.A., Hammad, A.E. (2010) Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys. Journal of Alloys and Compounds, 505. 793-800 doi:10.1016/j.jallcom.2010.06.142
Chang, Tao-Chih, Chou, Shih-Min, Hon, Min-Hsiung, Wang, Moo-Chin (2006) Microstructure and adhesion strength of Sn–9Zn–xAg lead-free solders wetted on Cu substrate. Materials Science and Engineering: A, 429. 36-42 doi:10.1016/j.msea.2006.04.093
El-Daly, A.A., Swilem, Y., Hammad, A.E. (2009) Creep properties of Sn–Sb based lead-free solder alloys. Journal of Alloys and Compounds, 471. 98-104 doi:10.1016/j.jallcom.2008.03.097
Luo, Tingbi, Chen, Zhuo, Hu, Anmin, Li, Ming (2012) Study on melt properties, microstructure, tensile properties of low Ag content Sn–Ag–Zn Lead-free solders. Materials Science and Engineering: A, 556. 885-890 doi:10.1016/j.msea.2012.07.086
El-Daly, A.A., El-Taher, A.M., Gouda, S. (2015) Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly. Journal of Alloys and Compounds, 627. 268-275 doi:10.1016/j.jallcom.2014.12.034
Sayyadi, Reza, Naffakh-Moosavy, Homam (2018) Physical and mechanical properties of synthesized low Ag/lead-free Sn-Ag-Cu-xBi (x = 0, 1, 2.5, 5 wt%) solders. Materials Science and Engineering: A, 735. 367-377 doi:10.1016/j.msea.2018.08.071
 
and/or  
Mindat.org is an outreach project of the Hudson Institute of Mineralogy, a 501(c)(3) not-for-profit organization.
Copyright © mindat.org and the Hudson Institute of Mineralogy 1993-2025, except where stated. Most political location boundaries are © OpenStreetMap contributors. Mindat.org relies on the contributions of thousands of members and supporters. Founded in 2000 by Jolyon Ralph.
To cite: Ralph, J., Von Bargen, D., Martynov, P., Zhang, J., Que, X., Prabhu, A., Morrison, S. M., Li, W., Chen, W., & Ma, X. (2025). Mindat.org: The open access mineralogy database to accelerate data-intensive geoscience research. American Mineralogist, 110(6), 833–844. doi:10.2138/am-2024-9486.
Privacy Policy - Terms & Conditions - Contact Us / DMCA issues - Report a bug/vulnerability Current server date and time: September 14, 2025 09:56:33
Go to top of page