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El-Daly, A.A., Hammad, A.E. (2010) Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys. Journal of Alloys and Compounds, 505. 793-800 doi:10.1016/j.jallcom.2010.06.142

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Reference TypeJournal (article/letter/editorial)
TitleElastic properties and thermal behavior of Sn–Zn based lead-free solder alloys
JournalJournal of Alloys and Compounds
AuthorsEl-Daly, A.A.Author
Hammad, A.E.Author
Year2010 (September)Volume505
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2010.06.142Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID11897005Long-form Identifiermindat:1:5:11897005:3
GUID0
Full ReferenceEl-Daly, A.A., Hammad, A.E. (2010) Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys. Journal of Alloys and Compounds, 505. 793-800 doi:10.1016/j.jallcom.2010.06.142
Plain TextEl-Daly, A.A., Hammad, A.E. (2010) Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys. Journal of Alloys and Compounds, 505. 793-800 doi:10.1016/j.jallcom.2010.06.142
In(n.d.) Journal of Alloys and Compounds Vol. 505. Elsevier BV

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El-Daly, A.A., Swilem, Y., Hammad, A.E. (2009) Creep properties of Sn–Sb based lead-free solder alloys. Journal of Alloys and Compounds, 471. 98-104 doi:10.1016/j.jallcom.2008.03.097
El-Daly, A.A., El-Tantawy, Farid, Hammad, A.E., Gaafar, M.S., El-Mossalamy, E.H., Al-Ghamdi, A.A. (2011) Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In. Journal of Alloys and Compounds, 509. 7238-7246 doi:10.1016/j.jallcom.2011.01.062
El-Daly, A.A., Swilem, Y., Makled, M.H., El-Shaarawy, M.G., Abdraboh, A.M. (2009) Thermal and mechanical properties of Sn–Zn–Bi lead-free solder alloys. Journal of Alloys and Compounds, 484. 134-142 doi:10.1016/j.jallcom.2009.04.108
El-Daly, A.A., Hammad, A.E., Al-Ganainy, G.S., Ragab, M. (2014) Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn. Journal of Alloys and Compounds, 614. 20-28 doi:10.1016/j.jallcom.2014.06.009
El-Daly, A.A., El-Taher, A.M., Dalloul, T.R. (2014) Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder. Journal of Alloys and Compounds, 587. 32-39 doi:10.1016/j.jallcom.2013.10.148
El-Daly, A.A., Ibrahiem, A.A., Hammad, A.E. (2018) Impact of permanent magnet stirring on dendrite growth and elastic properties of Sn–Bi alloys revealed by pulse echo overlap method. Journal of Alloys and Compounds, 767. 464-473 doi:10.1016/j.jallcom.2018.07.122
Shalaby, R.M. (2010) Effect of rapid solidification on mechanical properties of a lead free Sn–3.5Ag solder. Journal of Alloys and Compounds, 505. 113-117 doi:10.1016/j.jallcom.2010.05.179
El-Daly, A.A., Hammad, A.E. (2011) Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In. Journal of Alloys and Compounds, 509. 8554-8560 doi:10.1016/j.jallcom.2011.05.119
El-Daly, A.A., El-Hosainy, H., Elmosalami, T.A., Desoky, W.M. (2015) Microstructural modifications and properties of low-Ag-content Sn–Ag–Cu solder joints induced by Zn alloying. Journal of Alloys and Compounds, 653. 402-410 doi:10.1016/j.jallcom.2015.09.033
Islam, M.N., Chan, Y.C., Rizvi, M.J., Jillek, W. (2005) Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder. Journal of Alloys and Compounds, 400. 136-144 doi:10.1016/j.jallcom.2005.03.053
El-Daly, A.A., Hammad, A.E., Al-Ganainy, G.S., Ragab, M. (2014) Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders. Materials Science and Engineering: A, 608. 130-138 doi:10.1016/j.msea.2014.04.070
 
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