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Chen, Guang, Wu, Fengshun, Liu, Changqing, Xia, Weisheng, Liu, Hui (2015) Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder. Materials Science and Engineering: A, 636. 484-492 doi:10.1016/j.msea.2015.03.106

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Reference TypeJournal (article/letter/editorial)
TitleEffects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder
JournalMaterials Science and Engineering: A
AuthorsChen, GuangAuthor
Wu, FengshunAuthor
Liu, ChangqingAuthor
Xia, WeishengAuthor
Liu, HuiAuthor
Year2015 (June)Volume636
PublisherElsevier BV
DOIdoi:10.1016/j.msea.2015.03.106Search in ResearchGate
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Mindat Ref. ID10047089Long-form Identifiermindat:1:5:10047089:9
GUID0
Full ReferenceChen, Guang, Wu, Fengshun, Liu, Changqing, Xia, Weisheng, Liu, Hui (2015) Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder. Materials Science and Engineering: A, 636. 484-492 doi:10.1016/j.msea.2015.03.106
Plain TextChen, Guang, Wu, Fengshun, Liu, Changqing, Xia, Weisheng, Liu, Hui (2015) Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder. Materials Science and Engineering: A, 636. 484-492 doi:10.1016/j.msea.2015.03.106
In(n.d.) Materials Science and Engineering: A Vol. 636. Elsevier BV

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