Sun, Huayu, Chan, Y.C., Wu, Fengshun (2016) Effect of CNTs and Ni coated CNTs on the mechanical performance of Sn57.6Bi0.4Ag BGA solder joints. Materials Science and Engineering: A, 656. 249-255 doi:10.1016/j.msea.2016.01.045
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Effect of CNTs and Ni coated CNTs on the mechanical performance of Sn57.6Bi0.4Ag BGA solder joints | ||
Journal | Materials Science and Engineering: A | ||
Authors | Sun, Huayu | Author | |
Chan, Y.C. | Author | ||
Wu, Fengshun | Author | ||
Year | 2016 (February) | Volume | 656 |
Publisher | Elsevier BV | ||
DOI | doi:10.1016/j.msea.2016.01.045Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 10048193 | Long-form Identifier | mindat:1:5:10048193:2 |
GUID | 0 | ||
Full Reference | Sun, Huayu, Chan, Y.C., Wu, Fengshun (2016) Effect of CNTs and Ni coated CNTs on the mechanical performance of Sn57.6Bi0.4Ag BGA solder joints. Materials Science and Engineering: A, 656. 249-255 doi:10.1016/j.msea.2016.01.045 | ||
Plain Text | Sun, Huayu, Chan, Y.C., Wu, Fengshun (2016) Effect of CNTs and Ni coated CNTs on the mechanical performance of Sn57.6Bi0.4Ag BGA solder joints. Materials Science and Engineering: A, 656. 249-255 doi:10.1016/j.msea.2016.01.045 | ||
In | (n.d.) Materials Science and Engineering: A Vol. 656. Elsevier BV |
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