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Khodabakhshi, F., Sayyadi, R., Javid, N. Shahamat (2017) Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying: Microstructural evolution and mechanical durability. Materials Science and Engineering: A, 702. 371-385 doi:10.1016/j.msea.2017.07.024

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Reference TypeJournal (article/letter/editorial)
TitleLead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying: Microstructural evolution and mechanical durability
JournalMaterials Science and Engineering: A
AuthorsKhodabakhshi, F.Author
Sayyadi, R.Author
Javid, N. ShahamatAuthor
Year2017 (August)Volume702
PublisherElsevier BV
DOIdoi:10.1016/j.msea.2017.07.024Search in ResearchGate
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Mindat Ref. ID10050410Long-form Identifiermindat:1:5:10050410:5
GUID0
Full ReferenceKhodabakhshi, F., Sayyadi, R., Javid, N. Shahamat (2017) Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying: Microstructural evolution and mechanical durability. Materials Science and Engineering: A, 702. 371-385 doi:10.1016/j.msea.2017.07.024
Plain TextKhodabakhshi, F., Sayyadi, R., Javid, N. Shahamat (2017) Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying: Microstructural evolution and mechanical durability. Materials Science and Engineering: A, 702. 371-385 doi:10.1016/j.msea.2017.07.024
In(n.d.) Materials Science and Engineering: A Vol. 702. Elsevier BV

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Sayyadi, Reza, Naffakh-Moosavy, Homam (2018) Physical and mechanical properties of synthesized low Ag/lead-free Sn-Ag-Cu-xBi (x = 0, 1, 2.5, 5 wt%) solders. Materials Science and Engineering: A, 735. 367-377 doi:10.1016/j.msea.2018.08.071
Khodabakhshi, F., Zareghomsheh, M., Khatibi, G. (2020) Nanoindentation creep properties of lead-free nanocomposite solders reinforced by modified carbon nanotubes. Materials Science and Engineering: A, 797. 140203pp. doi:10.1016/j.msea.2020.140203
Han, Y.D., Gao, Y., Zhang, S.T., Jing, H.Y., Wei, J., Zhao, L., Xu, L.Y. (2019) Study of mechanical properties of Ag nanoparticle-modified graphene/Sn-Ag-Cu solders by nanoindentation. Materials Science and Engineering: A, 761. 138051pp. doi:10.1016/j.msea.2019.138051
Cheng, Fangjie, Nishikawa, Hiroshi, Takemoto, Tadashi (2008) Microstructural and mechanical properties of Sn–Ag–Cu lead-free solders with minor addition of Ni and/or Co. Journal of Materials Science, 43. 3643-3648 doi:10.1007/s10853-008-2580-7
Mostafa Shalaby, Rizk, Kamal, Mustafa, Ali, Esmail A.M., Gumaan, Mohammed S. (2017) Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly. Materials Science and Engineering: A, 690. 446-452 doi:10.1016/j.msea.2017.03.022
Gao, F., Takemoto, T. (2006) Mechanical properties evolution of Sn-3.5Ag based lead-free solders by nanoindentation. Materials Letters, 60. 2315-2318 doi:10.1016/j.matlet.2005.12.132
Kaftelen, Hülya, Öveçoğlu, M. Lütfi, Henein, Hani, Çimenoğlu, Hüseyin (2010) ZrC particle reinforced Al–4wt.% Cu alloy composites fabricated by mechanical alloying and vacuum hot pressing: Microstructural evaluation and mechanical properties. Materials Science and Engineering: A, 527. 5930-5938 doi:10.1016/j.msea.2010.06.007
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Carreño-Gallardo, C, Estrada-Guel, I, Martínez-Sánchez, R (2005) Microstructural Comparison of Lead-Free Solder (Bi5-Ag3-Cu0.5-Sn) Prepared by Mechanical Alloying and Casting Route. Microscopy and Microanalysis, 11. doi:10.1017/s1431927605503714
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